Characterisation of aluminium alloy 6061 for the ultrasonic consolidation process

Kong, C.Y.; Soar, Rupert; Dickens, Phill

doi:10.1016/s0921-5093(03)00590-2

Cited by 139 publications

(84 citation statements)

References 4 publications

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“…The work of Kong et al [2] hypothesised that during UC, instead of being broken up and displaced, the oxide layer remained and was subject to high dynamic interfacial stresses forming ceramic bonds at the weld interface. Matsuoka [13] has shown that metals and ceramics can easily be joined by ultrasonic welding and that the strength of the bonds between Al 2 O 3 and aluminium achieved can be similar to that of the base metal itself.…”

Section: The Nature Of Oxide Dispersal In Ucmentioning

confidence: 99%

New discoveries in ultrasonic consolidation nano-structures using emerging analysis techniques

Johnson

Edmonds

Higginson

et al. 2011

Proceedings of the Institution of Mechanical Engineers, Part L:

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This paper examines the influence of ultrasonic consolidation (UC) on the bonding interface and challenges existing opinion regarding the mechanism of oxide dispersal during UC bond formation. The findings presented in this paper were achieved through the use of dual beam focused ion beam (DBFIB) etching and transmission electron microscopy (TEM), enabling the close examination of the weld interface, sub-grain morphology, and dislocation structure in ultrasonically consolidated aluminium (Al) 3003-T0 samples.As a result of this investigation, it has been established that a persistent oxide layer between bonded foils often remains after UC with this material. The level of sub-grain refinement in ultrasonically consolidated components was seen to decrease as the distance from the weld interface increases. This trend was characterised by the nanoscale sub-grain and gradient subgrain regions, between which a distinct stepped transition was apparent. Direct contact with the sonotrode surface during the deposition of each new layer was also seen to cause significantly more sub-grain refinement than interface dynamics alone. Nano-grain colonies were also discovered in areas surrounding material flaws, manganese particles, or non-planar interface regions, and persistent dislocation slip bands were seen near the UC weld interface. In light of these results, the context of previously proposed methods of bond formation in UC is discussed.

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Section: The Nature Of Oxide Dispersal In Ucmentioning

confidence: 99%

New discoveries in ultrasonic consolidation nano-structures using emerging analysis techniques

Johnson

Edmonds

Higginson

et al. 2011

Proceedings of the Institution of Mechanical Engineers, Part L:

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“…The Alpha UC machine is a modified 3.3 kW ultrasonic seam welder which has a rotating tool steel sonotrode that oscillates at a frequency of 20 kHz. The Alpha UC machine had been used in several previously published works, [5,6,8,12,[15][16][17][18], and had three main operating parameters; that can be set individually. The parameters are amplitude of sonotrode oscillation (µm), welding speed (mm/s), and weld force (N).…”

Section: Sample Production For Interlaminar Characterisationmentioning

confidence: 99%

The effect of interface topography for Ultrasonic Consolidation of aluminium

Friel

Johnson

Dickens

et al. 2010

Materials Science and Engineering: A

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Ultrasonic Consolidation (UC) is an additive manufacturing technology which is based on the sequential solid-state ultrasonic welding of metal foils. UC presents a rapid and adaptive alternative process, to other metal-matrix embedding technologies, for 'smart' metal composite material production. A challenge that exists however relates to optimising, for bond density and plastic flow, the interlaminar textures themselves that serve as the contact surfaces between the foils. UC employs a sonotrode connected to a transducer to exude ultrasonic energy into the metal foil being sequentially deposited. This sonotrode to metal contact imparts a noteworthy topology to the processed metals surface that in turn becomes the crucial substrate topology of the subsequent layers deposition. This work investigated UC processed Al 3003 samples to ascertain the effect of this imparted topology on subsequent layer deposition. Surface and interlaminar topology profiles were characterised using interferometry, electron and light microscopy. The physical effect of the topology profiles were quantified via the use of peel testing.The imparted topology profile was found to be of fundamental significance to the mechanical performance and bond density achieved within the bulk laminate during UC. The UC process parameters and sonotrode topology performed a key role in modifying this topology profile. The concept of using a specifically textured sonotrode to attain desired future smart material performance via UC is proposed by the authors. ABSTRACTUltrasonic Consolidation (UC) is an additive manufacturing technology which is based on the sequential solid-state ultrasonic welding of metal foils. UC presents a rapid and adaptive alternative process, to other metal-matrix embedding technologies, for "smart" metal composite material production. A challenge that exists however relates to optimising, for bond density and plastic flow, the interlaminar textures themselves that serve as the contact surfaces between the foils.UC employs a sonotrode connected to a transducer to exude ultrasonic energy into the metal foil being sequentially deposited. This sonotrode to metal contact imparts a noteworthy topology to the processed metals surface that in turn becomes the crucial substrate topology of the subsequent layers deposition. This work investigated UC processed Al 3003 samples to ascertain the effect of this imparted topology on subsequent layer deposition. Surface and interlaminar topology profiles were characterised using interferometry, electron and light microscopy. The physical effect of the topology profiles were quantified via the use of peel testing.The imparted topology profile was found to be of fundamental significance to the mechanical performance and bond density achieved within the bulk laminate during UC. The UC process parameters and sonotrode topology performed a key role in modifying this topology profile. The concept of using a specifically textured sonotrode to attain desired future smart material performance vi...

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“…2). The equipment has been used in previous published work [4,5,7,11,[19][20][21][22], and has three key operating parameters; which can be individually set. These process parameters are welding speed (mm/s), contact The samples were produced by individually bonding (via UC) three Al 3003 (0) foil layers to an Al 1050 base plate (150 mm long × 1.2 mm thick × 28 mm wide).…”

Section: Sample Productionmentioning

confidence: 99%

A nanometre-scale fibre-to-matrix interface characterization of an ultrasonically consolidated metal matrix composite

Friel

Harris

2009

Proceedings of the Institution of Mechanical Engineers, Part L:

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• This is an article from the journal, Proceedings of the IMechE, Part L:Journal DOI: 10.1243/14644207JMDA268Abstract: Future 'smart' structures have the potential to revolutionize many engineering applications. One of the possible methods for creating smart structures is through the use of shape memory alloy (SMA) fibres embedded into metal matrices. Ultrasonic consolidation (UC) allows the embedding of SMAs into metal matrices while retaining the SMA's intrinsic recoverable deformation property. In this work, NiTi SMA fibres were successfully embedded into an Al 3003 (0) matrix via the UC layer manufacturing process. Initially the plastic flow of the Al matrix and the degree of fibre encapsulation were observed using optical microscopy. Then microstructural grain and sub-grain size variation of the Al 3003 (0) matrix at the fibre-matrix interface, and the nature of the fibre-matrix bonding mechanism, were studied via the use of focused ion beam (FIB) cross-sectioning, FIB imaging, scanning electron microscopy, and mechanical peel testing. The results show that the inclusion of the NiTi SMA fibres had a significant effect on the surrounding Al matrix microstructure during the UC process. Additionally, the fibre-matrix bonding mechanism appeared to be mechanical entrapment with the SMA surface showing signs of fatigue from the UC embedding process.

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Characterisation of aluminium alloy 6061 for the ultrasonic consolidation process

Cited by 139 publications

References 4 publications

New discoveries in ultrasonic consolidation nano-structures using emerging analysis techniques

New discoveries in ultrasonic consolidation nano-structures using emerging analysis techniques

The effect of interface topography for Ultrasonic Consolidation of aluminium

A nanometre-scale fibre-to-matrix interface characterization of an ultrasonically consolidated metal matrix composite

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