Characterisation of TFMS lines fabricated using photoimageable thick-film technology

Ng, C.Y.; Chongcheawchamnan, M.; Aftanasar, M.S.; Robertson, I.D.; Young, Paul R.; Minalgiene, J.

doi:10.1049/ip-map:20030413

Cited by 10 publications

(3 citation statements)

References 11 publications

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“…High impedances can be fabricated by increasing the dielectric height and using more printing steps, which is used to design microwave frequency circuits. 26…”

Section: Final Structurementioning

confidence: 99%

A compact Gysel power divider with ultra‐wide rejection band and high fractional bandwidth

Zonouri

Hayati

2021

Int J RF Microw Comput Aided Eng

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In this paper, one kind of miniaturized Gysel power divider (GPD) with ninth harmonic suppression is proposed. In this structure to weaken unwanted harmonics, radial and new trapezoidal-shaped resonators are placed instead of the quarter-wavelength transmission lines of the conventional GPD. Moreover, these resonators create eight transmission zeros and occupy small circuit sizes. For designing the proposed GPD, appropriate electrical lengths of transmission lines are selected. This GPD has high −15 dB fractional bandwidth, 71%, good isolation, > 15 dB, and compact sizes, 0.07 λ g ×0.22 λ g . The operating frequency of the designed power divider is 2.1 GHz that can be used in many WCDMA applications.

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“…High impedances can be fabricated by increasing the dielectric height and using more printing steps, which is used to design microwave frequency circuits. 26…”

Section: Final Structurementioning

confidence: 99%

A compact Gysel power divider with ultra‐wide rejection band and high fractional bandwidth

Zonouri

Hayati

2021

Int J RF Microw Comput Aided Eng

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“…MCM-D, using spin coating of dielectrics and evaporation of metals, has demonstrated excellent performance but can require relatively slow and complex fabrication processes [6]. Photoimageable thick film technology, with modern high quality materials and the capability to fabricate high resolution physical geometry is considered as a viable approach to the realisation of ceramic-based multilayer MCMs [7][8][9]. It is best suited to medium volume microwave and millimetre wave wireless applications.…”

Section: Introductionmentioning

confidence: 99%

High performance CPW embedded passive components using photoimageable thick film technology

Samanta

Robertson

2005

2005 European Microwave Conference

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This paper presents the characterisation and modelling of ceramic-based multilayer inductors and capacitors with remarkably high performance using photoimageable thick film technology. Passive components are developed with self resonance frequency of more than 40GHz. Based on the modelling, a highly miniaturised lumped-element CPW low pass filter is developed with a remarkably low passband insertion loss of 0.3dB and stopband attenuation >40 dB. This represents one of the highest passive component performances ever reported for MCM technology.

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“…To address the lack of precision in thick film technology, modern thick-film materials (photoimageable) are found to be well placed to meet these demanding requirements, as the process is straightforward and at the same time they offer low conductor and dielectric loss, good surface finish and the ability to realise fine conductor geometries (line width of 20m comfortably). The photoimageable thick film is used previously to developed dielectric-filled rectangular waveguides (substrate-integrated waveguides) and components successfully up to 100GHz[ I], The performance of thin film microstrip (TFM) lines using this technology on various substrates and that of individual components up to X-band has been reported [2][3][4][5]. To realize millimetre-wave multi-chip-module (MCM) using photoimageable thick film technology, a large number of multilayer and miniaturised components have been developed from 3 GHz to 65GHz with excellent performance.…”

Section: Introductionmentioning

confidence: 99%

Advanced multilayer thick-film technology for cost-effective millimetre-wave multi-chip modules

Samanta

Robertson

High Frequency Postgraduate Student Colloquium, 2005

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This paper describes the novel application of photoimageable thick film technology for the realization of multilayer millimeter-wave multi-chip modules at a low cost. The dielectric material has been characterized first time up to 110GHz with a novel technique. TFMS and CPW transmission lines have been characterized with a loss of 0.2dB/mm and 0.3 dB Imm respectively at 80GHz. High Q multilayer lumped components have been designed and modeled up to 40GHz with excellent performance. A 3GHz lumped element filter has remarkably low pass band loss of 0.3dB with high stop band attenuation (> 40 dB), and yet is highly miniaturized. Multilayer passive components have been designed and characterised up to 65 GHz and the performances are comparable to many reported results for thin film processes and even micro machined transmission lines.

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Characterisation of TFMS lines fabricated using photoimageable thick-film technology

Cited by 10 publications

References 11 publications

A compact Gysel power divider with ultra‐wide rejection band and high fractional bandwidth

A compact Gysel power divider with ultra‐wide rejection band and high fractional bandwidth

High performance CPW embedded passive components using photoimageable thick film technology

Advanced multilayer thick-film technology for cost-effective millimetre-wave multi-chip modules

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