Characteristic evaluation of electroless nickel–phosphorus deposits with different phosphorus contents

Yoon, Jeong‐Won; Park, Jong‐Hyun; Shur, Chang-Chae; Jung, Seung‐Boo

doi:10.1016/j.mee.2007.05.057

Cited by 65 publications

(50 citation statements)

References 13 publications

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“…107 spectrum shows that the phosphorus content is 11.3 weight % which is high phosphorus nickel coating with amorphous structure [17]. The properties of the electroless coatings are very sensitive to the amount of phosphorus content [18]. From SEM image shown in Fig.…”

Section: Methodsmentioning

confidence: 98%

Influence of Nano Al2O3 Particles on the Adhesion, Hardness and Wear Resistance of Electroless NiP Coatings

Karthikeyan¹,

Vijayaraghavan²

2015

IJMMM

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Abstract-In this present study electroless NiP coatings and NiP-Al 2 O 3 coatings had been deposited on a mild steel substrate. The surface morphology of both the coatings had studied using scanning electron microscope (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction technique. Adhesion, hardness and wear behavior were investigated and compared for NiP and NiP-Al 2 O 3 coatings. Optical micrograph images were used for the evaluation of adhesion of coatings which found sufficient and acceptable according to VDI 3198 standard. Hardness of the coating had been evaluated based on depth sensing techniques and substrate effect had avoided by maintaining depth to coating thickness ratio less than 0.1. Due to co-deposition of Al 2 O 3 particles the hardness of NiP coatings increased by 20.5% (7.8 GPa to 9.4 GPa). Dry sliding wear tests were conducted on PLINT TE66 micro scale tester against steel ball of hardness 800 HV. Wear resistance of NiP coatings increased with increase in sliding distance. The co-deposition of Al 2 O 3 particles in NiP matrix arrest the deformation during sliding of steel ball and thus wear resistance of NiP-Al 2 O 3 coatings is superior to NiP coatings. Wear crater morphology were studied using SEM and EDS. Adhesive wear mechanics was observed in NiP coatings and combination of adhesive and abrasive wear mechanism were found in NiP-Al 2 O 3 coatings.

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Section: Methodsmentioning

confidence: 98%

Influence of Nano Al2O3 Particles on the Adhesion, Hardness and Wear Resistance of Electroless NiP Coatings

Karthikeyan¹,

Vijayaraghavan²

2015

IJMMM

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“…[8][9][10][11][12][13] In the case of an ENIG surface finish, a P-rich Ni layer is formed with a relative increase in the P content in the Ni-P layer according to the reaction between Sn and Ni in the solder after reflow or thermal aging, and it is known that such a P-rich Ni layer is sensitive to external shocks, because of the Kirkendall voids distributed within this layer. 14) Accordingly, in this study, the drop test with or without Pd is performed by jointing a representative lead-free solder consisting of Sn-Ag-Cu on boards with ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold) surface finishes. Moreover, the mechanical reliability of the solder joints according to the thermal aging and Pd surface finish is evaluated by thermal aging.…”

Section: Introductionmentioning

confidence: 99%

Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint

Park

Jung

2011

Mater. Trans.

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The reliability of lead-free electronic assemblies after board-level drop tests was investigated. The effects of different PCB (Printed Circuit Board) surface finishes, viz. ENIG (Electroless Nickel Immersion Gold) and ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold), after reflow and thermal aging (1,000 h at 125 C) were studied. The increase of IMCs (Intermetallic Compounds) thickness after thermal aging in all of boards. However, as the change of the thickness of the IMC in the ENEPIG board before and after thermal aging was smaller than that of the ENIG board. The results of the drop test, ENEPIG board has greater reliability after reflow than the ENIG board and shows excellent characteristics under all conditions after thermal aging.

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“…Many researchers have reported that increasing the pH of the Ni-P plating solution increases the nodule size of the Ni-P layer. 10,26,27 However, Chow et al 28 reported that increasing the pH decreased the nodule size of Ni-P. In fact, their plating temperature was 88°C at pH of 4.8 and 44°C at pH of 8.5, Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints thus Chow et al decreased the plating temperature when they increased the pH.…”

Section: Resultsmentioning

confidence: 99%

“…[10][11][12] The P content in the Ni-P layer affects the interfacial IMC thickness, joint strength, and solder wettability. [10][11][12] These properties of the Ni-P layer depend on the Ni-P electroless plating conditions, including temperature, pH, additives, etc. Hence, the effects of these conditions on the properties of the Ni-P layer and the solder joint must be evaluated.…”

Section: Introductionmentioning

confidence: 99%

Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints

Seo

Kim

et al. 2017

Journal of Elec Materi

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The growth of interfacial intermetallic compound and the brittle fracture behavior of Sn-3.0Ag-0.5-Cu solder (SAC305) joints on electroless nickel immersion gold (ENIG) surface finish have been investigated using Ni-P plating solution at temperatures from 75°C to 85°C and fixed pH of 4.5. SAC305 solder balls with diameter of 450 lm were mounted on the prepared ENIG-finished Cu pads and reflowed with peak temperature of 250°C. The interfacial intermetallic compound (IMC) thickness after reflow decreased with increasing Ni-P plating temperature. After 800 h of thermal aging, the IMC thickness of the sample prepared at 85°C was higher than for that prepared at 75°C. Scanning electron microscopy of the Ni-P surface after removal of the Au layer revealed a nodular structure on the Ni-P surface. The nodule size of the Ni-P decreased with increasing Ni-P plating temperature. The Cu content near the IMC layer increased to 0.6 wt.%, higher than the original Cu content of 0.5 wt.%, indicating that Cu diffused from the Cu pad to the solder ball through the Ni-P layer at a rate depending on the nodule size. The sample prepared at 75°C with thicker interfacial IMC showed greater high-speed shear strength than the sample prepared at 85°C. Brittle fracture increased with decreasing Ni-P plating temperature.

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Characteristic evaluation of electroless nickel–phosphorus deposits with different phosphorus contents

Cited by 65 publications

References 13 publications

Influence of Nano Al2O3 Particles on the Adhesion, Hardness and Wear Resistance of Electroless NiP Coatings

Influence of Nano Al2O3 Particles on the Adhesion, Hardness and Wear Resistance of Electroless NiP Coatings

Effect of Pd Addition in ENIG Surface Finish on Drop Reliability of Sn-Ag-Cu Solder Joint

Effect of Ni-P Plating Temperature on Growth of Interfacial Intermetallic Compound in Electroless Nickel Immersion Gold/Sn-Ag-Cu Solder Joints

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