2010
DOI: 10.1016/j.mee.2010.01.021
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Characteristics of metal-ferroelectric-insulator-semiconductor structure using Sr0.8Bi2.2Ta2O9 and Sr0.8Bi2.2Ta2O9-BaZrO3 for ferroelectric gates

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Cited by 15 publications
(5 citation statements)
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“…This kind of shift is widely reported for different kind of ferroelectric materials (Bozgeyik et al 2010;Juan et al 2007). Furthermore, the sharp change in the capacitance at the accumulation and inversion region indicates that the interfaces of the junction are good.…”
Section: Methodssupporting
confidence: 64%
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“…This kind of shift is widely reported for different kind of ferroelectric materials (Bozgeyik et al 2010;Juan et al 2007). Furthermore, the sharp change in the capacitance at the accumulation and inversion region indicates that the interfaces of the junction are good.…”
Section: Methodssupporting
confidence: 64%
“…This in turn strengthens the repulsive force between neighboring domain walls. As a result, the mobility for the domain wall reduces, which in turn makes the domain reorientation more difficult (Bozgeyik et al 2010). Leading up to higher activation energy is required for the reorientation of the domains; as a result, the remnant polarization decreases, which reflects as a narrower memory window in C-V curves.…”
Section: Methodsmentioning
confidence: 99%
“…[1][2][3][4][5][6][7][8][9][10] Moreover, due to its unique properties mentioned above, BTO is used as a ferroelectric thin film in memory applications such as ferroelectric random access memory (FeRAM) where a metalferroelectric-metal (MFM) capacitor is used, [8] and ferroelectric field effect transistors (FeFETs) where ferroelectric material is used as the gate oxide in the form of metalferroelectric-semiconductor (MFS) or metal-ferroelectricinsulator-semiconductor (MFIS) structures. [11][12][13][14] In an MFS structure, the surface potential of the semiconductor is controlled by the remnant polarization of the ferroelectric thin film, [15] therefore ferroelectric materials are chosen in memory applications such as FeRAMs, FeFETs, etc.…”
Section: Introductionmentioning
confidence: 99%
“…Besides low permittivity, the gate ferroelectric film requires a relatively low remanent polarization (P r ) of around 1 µC cm −2 to match the requisite charge for channel conductivity controlling in the memory process [8]. Hence, the key parameters of ferroelectric thin films for 1T-type FeRAMs are quite small dielectric constant (ε r ) and remanent polarization (P r ) around 1 µC cm −2 as discussed by the related researchers [9][10][11]. These qualities have become the motivation for research devoted to SBT as the most suitable candidate gate ferroelectric for FeFET-type FeRAMs.…”
Section: Introductionmentioning
confidence: 99%