2007
DOI: 10.1016/j.jcrysgro.2007.07.043
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Characteristics of (Pb,Sr)TiO3 thin films with various Sr content

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Cited by 14 publications
(4 citation statements)
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“…4. T is defined as [ε r(T,0) − ε r(T,E) ]/ε r(T,0) , where ε r(T,0) and ε r(T,E) are defined as before [19]. As expected, the tunability for both graded films is increased with electric-field increasing.…”
Section: Resultsmentioning
confidence: 62%
“…4. T is defined as [ε r(T,0) − ε r(T,E) ]/ε r(T,0) , where ε r(T,0) and ε r(T,E) are defined as before [19]. As expected, the tunability for both graded films is increased with electric-field increasing.…”
Section: Resultsmentioning
confidence: 62%
“…5–7 When substituting Sr onto the Pb-site, Pb 1− x Sr x TiO 3 (PST), the tetragonality of the structure is reduced and the cubic structure is reached at room temperature for x = 0.5. 8–10 Controlling the Sr-content and thereby the structure allows the electrical properties to be tuned. 9,11 This includes reducing the T Curie but also stabilizing a -domains having interesting nanoscale switching phenomena when grown as thin films.…”
Section: Introductionmentioning
confidence: 99%
“…8–10 Controlling the Sr-content and thereby the structure allows the electrical properties to be tuned. 9,11 This includes reducing the T Curie but also stabilizing a -domains having interesting nanoscale switching phenomena when grown as thin films. 12…”
Section: Introductionmentioning
confidence: 99%
“…Assembling LSMO and LCMO together is expected to obtain large MR and low r over a wider temperature range near room temperature. Pb 0.6 Sr 0.4 TiO 3 (PST) was chosen as dielectric layer for its excellent dielectric properties, whose lattice structure is simple and has only one phase transition, that is the ferroelectric-paraelectric phase transition, and the T c is far above 400 K. [27][28][29] Compared with pulsed laser deposition and sputtering, CSD has the advantages of excellent chemical homogeneity, easy control of stoichiometry, and suitable for large area. [30][31][32] Si wafer was chosen as substrate because the Si wafer is one of the main micro-electronic materials, which is essential for future commercial applications.…”
Section: Introductionmentioning
confidence: 99%