Characteristics of Reactive Ni3Sn4 Formation and Growth in Ni-Sn Interlayer Systems

Lis, Adrian; Kenel, Christoph; Leinenbach, Christian

doi:10.1007/s11661-016-3444-4

Cited by 19 publications

(6 citation statements)

References 32 publications

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“…Both Sn preforms [26] and deposited layers have been used. The deposited layers have been electroplated [27,28,30], e-beam [32], thermally evaporated, sputtered [25,32] or a combination of the abovementioned methods. …”

Section: Resultsmentioning

confidence: 99%

“…The high-temperature compatibility is the most frequent reason for investigating the Ni-Sn system [25][26][27]. In addition, Nickel and tin are relatively low-cost materials which make them attractive for more cost-sensitive applications [26,28]. The formed IMCs may also have matching thermomechanical material properties which may be critical in applications with very high operation temperatures [29].…”

Section: Rationale For Ni-snmentioning

confidence: 99%

“…The relatively low melting point of Sn, 232°C, also allows similar process temperatures as the Cu-Sn system. In addition, the excellent corrosion resistance of Ni [28] makes the Ni-Sn system attractive for forming SLID joints. Still, information on Ni-Sn SLID joints is sparse.…”

Section: Rationale For Ni-snmentioning

confidence: 99%

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Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding

Aasmundtveit¹,

Luu²,

Nguyen³

et al. 2018

Intermetallic Compounds - Formation and Applications

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Solid-liquid interdiffusion (SLID) bonding for microelectronics and microsystems is a bonding technique relying on intermetallics. The high-melting temperature of intermetallics allows for system operation at far higher temperatures than what solder-bonded systems can do, while still using similar process temperatures as in common solder processes. Additional benefits of SLID bonding are possibilities of fine-pitch bonding, as well as thin-layer metallurgical bonding. Our group has worked on a number of SLID metal systems. We have optimized wafer-level Cu-Sn SLID bonding to become an industrially feasible process, and we have verified the reliability of Au-Sn SLID bonding in a thermally mismatched system, as well as determined the actual phases present in an Au-Sn SLID bond. We have demonstrated SLID bonding for very high temperatures (Ni-Sn, having intermetallics with melting points up to 1280°C), as well as SLID with low process temperatures (Au-In, processed at 180°C, and Au-In-Bi, processed at 90-115°C). We have verified experimentally the high-temperature stability for our systems, with quantified strength at temperatures up to 300°C for three of the systems: Cu-Sn, Au-Sn and Au-In.Keywords: microelectronics/microsystem assembly, bonding technology, harsh environments, wafer processing, reliability, transient liquid phase © 2018 The Author(s). Licensee IntechOpen. This chapter is distributed under the terms of the Creative Commons Attribution License (http://creativecommons.org/licenses/by/3.0), which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited. Motivation for SLID The challenge of die attach and interconnectionFor all electronic systems, the attachment of components to substrates and their electrical connection is a crucial part of the system. Traditionally, the processes for attachment and interconnection have been considered more a craft than a science. The historical focus of electronics and microtechnology has been on the design, manufacturing and testing of components, circuits and devices, rather than on the system integration and the processes needed for actually building the system. The 'electronic revolution' has given ever-increasing performance of devices at ever-decreasing prices for more than half a century. Initial milestones were the invention of the transistor (1947) and the integrated circuit (IC) (1958). The driving factor has been a continuous decrease in size (of components and on features of components) and cost, made possible through batch processing of silicon wafers. Single-crystal silicon is a very well-defined material with extremely well-characterized properties, allowing process technology that yields extremely small features (10 nm by 2017, with a further decrease expected). Miniaturization of components and the use of large Si wafers give a huge number of components manufactured in every batch, lowering the cost. Furthermore, miniaturization allows an increase in operating frequency (or a decrease...

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Section: Resultsmentioning

confidence: 99%

Section: Rationale For Ni-snmentioning

confidence: 99%

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Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding

Aasmundtveit¹,

Luu²,

Nguyen³

et al. 2018

Intermetallic Compounds - Formation and Applications

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“…It is known that a dense Ni 3 Sn 4 IMCs layer always forms at a Sn/Ni interface [22]. Previous studies demonstrated that the Ni 3 Sn 4 IMC layer was an excellent elemental diffusion barrier layer, which could inhibit the mutual diffusion of Ni and Sn [22,23]. The Ni 3 Sn 4 phase is few found in the joint soldered with Ni/Sn composite solder (Fig.…”

Section: Metallurgic Reaction Mechanism Of Cu Jointsmentioning

confidence: 97%

Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam

Huang

et al. 2020

Journal of Alloys and Compounds

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In this study, Ni foam, Cu coated Ni foam and Cu-Ni alloy foams were used as strengthening phases for pure Sn solder. Cu-Cu joints were fabricated by soldering with these Sn-based composite solders at 260 °C for different times. The tensile strength of pure Sn solder was improved significantly by the addition of metal foams, and the Cu-Ni alloy/Sn composite solder exhibited the highest tensile strength of 50.32 MPa. The skeleton networks of the foams were gradually dissolved into the soldering seam with increasing soldering time, accompanied by the massive formation of (Cu,Ni) 6 Sn 5 phase in the joint. The dissolution rates of Ni foam, Cu coated Ni foam and Cu-Ni alloy foams into the Sn matrix increased successively during soldering. An increased dissolution rate of the metal foam leads to an increase in the Ni content in the soldering seam, which was found to be beneficial in refining the (Cu,Ni) 6 Sn 5 phase and inhibiting the formation of the Cu 3 Sn IMC layer on the Cu substrate surface. The average shear strength of the Cu joints was improved with increasing soldering time, and a shear strength of 2 61.2 MPa was obtained for Cu joints soldered with Cu-Ni alloy/Sn composite solder for 60 min.

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“…Therefore, to improve the reliability of solder joints, a Ni barrier is typically introduced between the Cu and Sn solder to reduce the IMC thickness. Studies have shown that the growth kinetics of IMC layers at the interface between Ni and liquid Sn-based solder is much lower than those at the Cu/solder interface (Lis et al , 2016; Faizan, 2015; Akihiro et al , 2016). Currently, a Ni/Sn-based solder/Ni interconnected structure is widely used in electronic packaging.…”

Section: Introductionmentioning

confidence: 99%

Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint

Liu

et al. 2019

SSMT

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Purpose This paper aims to investigate the effect of ultrasonic vibration (USV) on the evolution of intermetallic compounds (IMCs), grain morphology and shear strength of soldered Ni/Sn/Ni samples. Design/methodology/approach The Ni/Sn/Ni joints were obtained through ultrasonic-assisted soldering. The formation of IMCs, their composition, grain morphology and the fractured-surface microstructures from shear tests were characterized using scanning electron microscopy and energy-dispersive x-ray spectroscopy. Findings Without USV, a planar interfacial Ni3Sn4 layer was formed at the Ni/Sn interface, and a few Ni3Sn4 grains were distributed in the soldered joint. The morphology of these grains was needle-shaped. With USV, several grooves were formed at the interfacial Ni3Sn4 layer due to ultrasonic cavitation. Some deepened grooves led to “neck” connections at the roots of the Ni3Sn4 grains, which accelerated the strong detachment of Ni3Sn4 from the substrate. In addition, two types of Ni3Sn4 grains, needle-shaped and granular-shaped, were observed at the interface. Furthermore, the shear strength increased with longer USV time, which was attributed to the thinning of the interfacial IMC layers and dispersion strengthening from the Ni3Sn4 particles distributed evenly in the joint. Originality/value The novelty of the paper is the detailed study of the effect of USV on the morphology, size changes of interfacial IMC and joint strength. This provides guidance for the application of ultrasonic-assisted soldering in electronics packaging.

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Characteristics of Reactive Ni3Sn4 Formation and Growth in Ni-Sn Interlayer Systems

Cited by 19 publications

References 32 publications

Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding

Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding

Microstructure and mechanical properties of Cu joints soldered with a Sn-based composite solder, reinforced by metal foam

Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint

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