2013
DOI: 10.1007/s13391-012-2173-0
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Characteristics of reactively sputtered niobium nitride thin films as diffusion barriers for Cu metallization

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Cited by 14 publications
(7 citation statements)
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“…Thus, they suggested that the NbN was relatively better than Nb and TaN as a diffusion barrier for copper interconnects. [ 197 ] In addition to this, several researchers attempted to improve the mechanical and tribological properties of NbN films by using the codeposition sputtering technique. The metals such as silicon, [ 198 ] aluminum, [ 199 ] bismuth, [ 200 ] copper, [ 201 ] and silver [ 202 ] were commonly engaged for codeposition along with niobium for the formation of composite nitrides in various studies.…”
Section: Surface Properties and Applications Of Tmnsmentioning
confidence: 99%
“…Thus, they suggested that the NbN was relatively better than Nb and TaN as a diffusion barrier for copper interconnects. [ 197 ] In addition to this, several researchers attempted to improve the mechanical and tribological properties of NbN films by using the codeposition sputtering technique. The metals such as silicon, [ 198 ] aluminum, [ 199 ] bismuth, [ 200 ] copper, [ 201 ] and silver [ 202 ] were commonly engaged for codeposition along with niobium for the formation of composite nitrides in various studies.…”
Section: Surface Properties and Applications Of Tmnsmentioning
confidence: 99%
“…Нитрид ниобия ввиду комбинации своих уникальных физических и химических свойств имеет множество различных применений. Высокая температура плавления, химическая и механическая стойкость [1,2], относительно хорошая электрическая проводимость дают возможность использовать этот материал в качестве износостойких и биосовместимых покрытий [3,4], диффузионного барьера для создания медной металлизации [5] и электрода затвора для устройств на КМОП (комплементарная логика с транзисторами на металлоксид-полупроводнике) [6]. Также множество применений этого материала связано с его сверхпроводящими свойствами.…”
Section: Introductionunclassified
“…[1][2]. Due to their applicability in MEMS industry, thin films still present interest for researchers [3][4] and several methods have been used to deposit niobium nitride (NbN) thin films [5][6][7].…”
Section: Introductionmentioning
confidence: 99%