Characterization and analysis on the solder ball shear testing conditions

Huang, Xingjia; Lee, S.-W.R.; Yan, Chien Chun; Hui, Shen

doi:10.1109/ectc.2001.927949

Cited by 47 publications

(3 citation statements)

References 13 publications

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“…9 At present, the most popular technique to evaluate the strength of solder ball attachment is the ball shear test. Huang et al 10,11 investigated the effects of shear height and shear speed on the solder ball shear strength using the ball shear test. Experimental investigation and computational modeling was adopted to investigate the problem and they found that, the shear force increased with the shear speed and decreased with the shear height.…”

Section: Introductionmentioning

confidence: 99%

Solder joint reliability of Sn–0·7Cu and Sn–0·3Ag–0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses

Satyanarayan

Prabhu

2013

Materials Science and Technology

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The bond shear test was used to assess the integrity of Sn–0·7Cu and Sn–0·3Ag–0·7Cu lead-free solder alloy drops solidified on copper substrates with smooth and rough surface finishes. Solder alloys solidified on smooth substrates required higher shear force compared to that on rough substrates. Sn–0·3Ag–0·7Cu alloy required higher shear energy than Sn–0·7Cu alloy. Solder alloys solidified on smooth substrate surfaces exhibited complete ductile failure. On rough copper surfaces, solder alloys showed a transition ridge characterized by sheared intermetallic compounds (IMCs) and the presence of dimples. The peak shear strength decreased with increase in contact area of the solder bond on the substrate. Smooth surface and the presence of minor amount of Ag in the solder alloy enhance the integrity of the solder joint.

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Section: Introductionmentioning

confidence: 99%

Solder joint reliability of Sn–0·7Cu and Sn–0·3Ag–0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses

Satyanarayan

Prabhu

2013

Materials Science and Technology

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“…The pull test reliability of gold wires bonded on the Cu/low-K wafer was simulated by Chang-Lin Yeh and Yi-Shao Lai [5] . Nonetheless, shear test simulation for wire bond is yet to be identified, but there are some work done on shear test simulation in BGA packages [6]. Hence, in this paper, the simulation of wire bond shear test on a sharp groove surface bond pad is introduced.The stress response of the wire ball bond during wirebond shear test was evaluated by simulation.…”

Section: Introductionmentioning

confidence: 99%

Wire Bond Shear Test Simulation on Sharp Groove Surface Bond Pad

Sauli

Retnasamy

Taniselass

et al. 2012

AMR

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Wire bonding process is first level interconnection technology used in the semiconductor packaging industry. The wire bond shear tests are used in the industry to examine the bond strength and reliability of the bonded wires. Hence, in this study thesimulation on wire bond shear test is performed on a sharp groove surface bond pad. ANSYS ver 11 was used to perform the simulation. The stress response of the bonded wires are investigated.The effects of three wire materials gold(Au), aluminum(Al) and copper(Cu) on the stress response during shear test were examined. The simulation results showed that copper wire bond induces highest stress and gold wire exhibits the least stress response.

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“…Chang-Lin Yeh and Yi-Shao Lai [5] demonstrated pull test reliability of gold wires bonded on the Cu/low-K wafer by simulation. However, shear test simulation on wire bond is still limitedly explored even though there are some work done on shear test simulation in ball grid array(BGA) packages [6].…”

Section: Introductionmentioning

confidence: 99%

Wire Bond Shear Test Simulation on Hemispherical Surface Bond Pad

Sauli

Retnasamy

Norhaimi

et al. 2012

AMR

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Wire bonding process is an interconnection method adopted in the semiconductor packaging manufactory. One of the method used to assess the reliability and bond strength of the bonded wires are wire bond shear test .In this study, simulation on wire bond shear test is done to evaluate the stress response of the bonded wire when sheared on a hemispherical surface bond pad. The contrast between three types of wire material:gold(Au), aluminum(Al) and copper(Cu) were carry out to examine the effects of wire material on the stress response of bonded wire during wire bond shear test. The simulation results showed that copper wire bond induces highest stress and gold wire exhibits the least stress response.

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Characterization and analysis on the solder ball shear testing conditions

Cited by 47 publications

References 13 publications

Solder joint reliability of Sn–0·7Cu and Sn–0·3Ag–0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses

Solder joint reliability of Sn–0·7Cu and Sn–0·3Ag–0·7Cu lead-free solder alloys solidified on copper substrates with different surface roughnesses

Wire Bond Shear Test Simulation on Sharp Groove Surface Bond Pad

Wire Bond Shear Test Simulation on Hemispherical Surface Bond Pad

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