Wire Bond Shear Test Simulation on Sharp Groove Surface Bond Pad

Hashim

et al. 2014

AMR

Conventional gold wire bonding to alunimium bond pads leads to the formation of intermetallic compound. Electroless Nickel Immersion Gold (ENIG) has been proposed as surface finish for aluminium bond pads to improve high temperature reliability. In order to create acceptable solder bumps prior to reflow process, a particular bump height for ENIG bumps need to be obtained. This paper reports the effects of chemical bath temperature in response to the bump height using a shorter process time. Analysis was done by using a design of experiment (DOE). The results suggest that higher temperature increases the bump height. Electroless nickel temperature has more influence to the bump height compared to immersion gold temperature.

Section: Methodsmentioning

confidence: 99%

Chemical Bath Temperature Investigation for Electroless Nickel Immersion Gold

Hashim

et al. 2014

AMR

“…The principal motive of this report was to perform simulation to assess the junction temperature and the stress of single chip LED package under natural convection condition. The simulation was accomplished using Ansys version 11 [10,11]. The LED chip was power with input power of 0.1W and 1 W.…”

Section: Introductionmentioning

confidence: 99%

5mm X 5mm Copper-Diamond Composite Slug Stress Evaluation on LED

Vairavan

2013 7th Asia Modelling Symposium

et al. 2013

Light-emitting diodes (LEDs), have materialized as an innovative light source which features energy saving properties, good optical performance and efficacy which is added advantage over orthodox lighting systems. However, the efficacy of the LED is influenced by heat generated at the junction of the LED. Hence, in this study, the thermal and stress analysis of single chip LED package with copper diamond heat slug with dimension of 5mm x 5mm x 1mm was carried out through simulation under natural convection condition. Input power of 0.1W and 1W were applied to the single chip LED model. Result of the simulation indicates that at input power 1W, junction temperature of 107.02 °C and stress of 104.59 MPa were obtained.

“…The foremost objective of this study was to appraise the junction temperature of LED package through simulation under natural convection condition. Ansys version 11 [12] was utilized for the simulation. Copper heat slug was employed in this study.The LED chip were powered with input power of 0.1 W and 1 W. Plus, stress of the LED chip during functioning mode were evaluated.…”

Section: Introductionmentioning

confidence: 99%

High Power LED Thermal and Stress Simulation on Copper Slug

Vairavan

2013 UKSim 15th International Conference on Computer Modelling and Simulation

et al. 2013

Self Cite

High power LED are captivating attention due to its cogent impacts on lighting industry in terms of efficacy, low power consumption, long lifetime and miniature physical size. Nonetheless, the efficiency and reliability of the LED is signified by the junction temperature. This work demonstrates the thermal and stress simulation of single chip LED package with 1mm x1mm x 1mm copper heat slug. The simulation was performed using Ansys version 11. The GaN LED chip was powered with input power of 0.1 W and 1 W. The simulation outcome exhibited that at the maximum junction temperature and stress of the LED chip were 115.81°C and 221.56MPa correspondingly for input power of 1W.