High Power LED Thermal and Stress Simulation on Copper Slug

Abstract

High power LED are captivating attention due to its cogent impacts on lighting industry in terms of efficacy, low power consumption, long lifetime and miniature physical size. Nonetheless, the efficiency and reliability of the LED is signified by the junction temperature. This work demonstrates the thermal and stress simulation of single chip LED package with 1mm x1mm x 1mm copper heat slug. The simulation was performed using Ansys version 11. The GaN LED chip was powered with input power of 0.1 W and 1 W. The simulation outcome exhibited that at the maximum junction temperature and stress of the LED chip were 115.81°C and 221.56MPa correspondingly for input power of 1W.

Effects of Heat Slug Shapes on the Heat Dissipation of High Power LED

“…In this work, two 3D finite element model of a single chip LED package mounted on heat sink with varied heat slug shapes were constructed using Ansys version 11 [7,8,9]. Simulation condition and enviroment were set under natural convection condition at ambient temperature of 25 °C.The analysis was carried out with two types of aluminum based heat slug shapes, rectangular and cylindrical.…”

“…The junction temperature and von Mises stress of the LED chip with varied heat slug shapes were then examined thorugh the simulation software. Moreover, the thermal resistance of the LED chip with varied heat slug shapes were calculated using Equation 1 which is defined as [7,8,9]:…”

“…Where R JA is defined as thermal resistance, T j is defined as the junction temperature, T a is defined as the ambient temperature, P is defined as the input power [9].…”

High Power LED Heat Dissipation Comparison Analysis via Aluminum and Copper Slug

“…A single chip high power LED package model was developed in 3D by utilizing Ansys version 11 [7,8]. The LED model comprises of seven components and the dimension of the 3D model is presented in Table 1.…”

The Effect of Different Filament Arrangements on Thermal and Optical Performances of LED Bulbs

“…The major thermal physical parameters of LED filament bulbs were shown in Table 1. At present, the efficiency of LED converting input power into heat is 70%-80% [17,27,28], so the total heat dissipation rate is 2.45 W when the power is 3.5 W for the thermal design. The simulation results of temperature distribution and gas flow path of three different filament arrangements are shown in Figure 6.…”