Characterization and modeling of electronic packages using S-parameters

Abstract

In this paper, we demonstrate the feasibility to characterize and model singled-ended electronic packages using experimental S-parameters up to 30 GHz. TRL calibration and transmission line theory techniques were applied to obtain the two-port network parameters of the packages from measurements performed to package-to-transmission line test structures. With this information, an assessment of the performance of the package was carried out, as well as the development of equivalent circuit models to represent this structure up to 30 GHz. The methodology is explained step-by-step including the description of the required prototypes. Excellent agreement of the resulting models with experimental data validates the proposed methodology.

Design for the Package-Board Transition and Its Testability Design in the Fan-Out Wafer-Level Package

“…[28] proposed a novel concept based on the Thru-Reflect-Line (TRL) calibration algorithm for the characterization of a single transition through the wafer. [29] demonstrated the feasibility of characterizing the singled-ended electronic packages using experimental S-parameters up to 30 GHz. TRL calibration and transmission line theory techniques were used here.…”