Characterization and optimization to improve uneven surface on MEMS bridge fabrication

Effect of deposition parameters on surface roughness and consequent electromagnetic performance of capacitive RF MEMS switches: a review

“…In addition to the annealing temperature, thermal reflow is another process that can be applied in the MEMS process [183][184][185][186]. Ahamed et al [183] indicated that the surface roughness improvement of MEMS vibratory sensors was tenfold at 700 °C for 30 min.…”

“…These processing materials should be polymers or low glass transition temperature materials. Mafinejad et al [184] analyzed the effects of thermal reflow on the sacrificial layer to improve the surface roughness of the MEMS bridge of RF MEMS switches. The results found that the surface roughness of the metal bridge after thermal reflow at 200 °C for 5 min became uniform [184].…”

“…Mafinejad et al [184] analyzed the effects of thermal reflow on the sacrificial layer to improve the surface roughness of the MEMS bridge of RF MEMS switches. The results found that the surface roughness of the metal bridge after thermal reflow at 200 °C for 5 min became uniform [184]. Villeneuve et al [185] analyzed the planarization optimization of gold membrane RF-MEMS switches after thermal reflow and CMP.…”

A novel analytical technique to omit the spurious passband in inductively coupled bandpass filter structures

“…The recently developed microelectromechanical systems commonly known as MEMS have enabled the design and development of a new generation of electronic devices, particularly RF switches. These switches could be employed in RF circuits with a better performance than other standard switches such as field-effect transistors (FET) and positive intrinsic negative (PIN) diodes, due to their good specifications such as low IL, small size, good performances over a wide frequency band, and so on [8][9][10][11].…”