1998
DOI: 10.1016/s0257-8972(97)00253-3
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Characterization of a magnetron sputtering discharge with simultaneous RF- and DC-excitation of the plasma for the deposition of transparent and conductive ZnO:Al-films

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Cited by 23 publications
(17 citation statements)
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“…It can be seen that at the same deposition rate, realized by different discharge powers for DC (25 W) and RF excitation (100 W), the O 2 -partial pressure where the minimum resistivity is obtained is significantly lower for RF-, compared to DC-excitation. This, we ascribe to the much higher density of reactive oxygen species (O, O*, O + ) in the RF discharge, which was measured already in 1998 by us for the reactive magnetron sputter deposition of ZnO:Al films [47]. The minimum resistivity is about the same for both excitation modes (ρ min ≈ 5 × 10 −3 Ωcm); however, the width of the minimum is significantly wider in case of DC plasma excitation.…”
Section: Resistivitysupporting
confidence: 50%
“…It can be seen that at the same deposition rate, realized by different discharge powers for DC (25 W) and RF excitation (100 W), the O 2 -partial pressure where the minimum resistivity is obtained is significantly lower for RF-, compared to DC-excitation. This, we ascribe to the much higher density of reactive oxygen species (O, O*, O + ) in the RF discharge, which was measured already in 1998 by us for the reactive magnetron sputter deposition of ZnO:Al films [47]. The minimum resistivity is about the same for both excitation modes (ρ min ≈ 5 × 10 −3 Ωcm); however, the width of the minimum is significantly wider in case of DC plasma excitation.…”
Section: Resistivitysupporting
confidence: 50%
“…With this configuration, the resistivity increase at the location on the substrate surface that corresponds to the erosion area of the target in films prepared by dc-MSD was always higher than that in films prepared by rf-MSD or rf+dc-MSD [32]. The increase in resistivity is attributable to an enhancement in the amount and activity of oxygen that reaches the location on the substrate surface corresponding to the erosion area of the target, resulting from negatively ionized oxygen accelerated by the higher d.c. sputter voltage in dc-MSD than in rf-MSD or rf+dc-MSD [28,32,[34][35][36][37][38][39]. In the current work using moving substrates during the deposition, the amount of resistivity obtainable in the thin films exhibits an average value that is related to the resistivity distribution that results from depositions on the surface of fixed substrates.…”
Section: Influence Of Doped Impurity and Deposition Methods On Electrimentioning
confidence: 99%
“…However, the plasma potential is positive with respect to ground, so Ellmer et al 41 Ϫ , are also produced in the plasma. Positive ions (Ar ϩ ,O ϩ ,O 2 ϩ ) are generally accelerated towards the target and do not bombard the growing film.…”
Section: Dependence Of the Strain On Deposition Parametersmentioning
confidence: 99%