Characterization of Adhesive-Bonded Sheet Metal Joints

Yan, Cuifen; Wu, Xin; Nassar, Sayed A.

doi:10.1115/imece2011-63498

Cited by 2 publications

(11 citation statements)

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“…Specimen geometry and setup for single-lap tension shear test using Instron 8801 servo-hydraulic system. [16] 2072 C. Yan et al…”

Section: Mechanical Testingmentioning

confidence: 96%

“…Bonding strengths of four selected adhesives used to bond AA6061 with G60 grinding in random orientation. [16] 2076…”

Section: Effect Of Surface Roughnessmentioning

confidence: 98%

“…Effect of surface roughness on the adhesive bonding strength (T308). [16] Journal of Adhesion Science and Technology 2077…”

Section: Max Shear Stress (Mpa)mentioning

confidence: 99%

“…At room temperature, most adhesives exhibit brittle behavior; thus for the purpose of this study, the constitutive relation of the adhesive may be approximated by [6] as follows r adhs eq ¼ E e adhs eq (16) where r adhs eq and e adhs eq are the effective equivalent stress and strain of adhesive, respectively, and E is the effective Young's modulus of the adhesive material, it is a function of the initial Young's modulus E 0 and stress level r adhs eq as follows…”

Section: Damage Of the Adhesive Materialsmentioning

confidence: 99%

“…Yan et al [16,17] studied the effect of surface scratch orientations and adhesive layer thickness. These works provided insight into the damage modeling of structural joints, but a more comprehensive study is still necessary for building the correlation between experimental data to model results.…”

Section: Introductionmentioning

confidence: 99%

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Experimental and numerical investigation of the effect of key joint variables on the static and fatigue performance of bonded metallic single-lap joints

Yan

Mao

Nassar

et al. 2014

Journal of Adhesion Science and Technology

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Experimental and numerical investigation of the effect of key joint variables on the static and fatigue performance of bonded metallic single-lap joints, In this paper, numerical and experimental methods are employed to investigate the effect of surface preparation, adhesive type and thickness, and nanoparticle enrichment on the mechanical performance of bonded metallic single-lap joints. Adherents are made of similar materials; namely, steel-on-steel or aluminum-on-aluminum. Investigated surface preparation variables include roughness and scratch orientation. Adhesive-related variables include thickness, type, and nanoparticle enrichment. Four different commercially available adhesives are investigated, some of which are nanoparticle enriched for the purpose of this study. Static and/or fatigue testing as well as damage analysis-based numerical prediction of joint performance, are provided. Scanning Electron Microscope (SEM) is used for macro joint characterization through the micro observation of joint fracture surfaces. Experimental fatigue data correlates reasonably well with the numerical results obtained from damage-coupled cohesive model of the adhesive layer.

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“…Specimen geometry and setup for single-lap tension shear test using Instron 8801 servo-hydraulic system. [16] 2072 C. Yan et al…”

Section: Mechanical Testingmentioning

confidence: 96%

“…Bonding strengths of four selected adhesives used to bond AA6061 with G60 grinding in random orientation. [16] 2076…”

Section: Effect Of Surface Roughnessmentioning

confidence: 98%

“…Effect of surface roughness on the adhesive bonding strength (T308). [16] Journal of Adhesion Science and Technology 2077…”

Section: Max Shear Stress (Mpa)mentioning

confidence: 99%

Section: Damage Of the Adhesive Materialsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Experimental and numerical investigation of the effect of key joint variables on the static and fatigue performance of bonded metallic single-lap joints

Yan

Mao

Nassar

et al. 2014

Journal of Adhesion Science and Technology

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Reliability Performance of Conductive Ink Subjected to Hygrothermal Aging

Zainal,

Buyamin,

Fadzulllah

et al. 2019

IJEAT

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In the era of rapid technological development, the popularity in printed technologies and electronic packaging have resulted in a tremendous increase in the use of carbon-based conductive ink due to their advantageous features such as being environmental-friendly, low cost and lower assembly temperature. From the literature, it has been highlighted that the interconnect material are exposed to some degree of humidity and elevated temperature during the service life in an actual application. Todate, there is not yet a great length of literature reporting on the reliability performance of such materials when exposed to hygrothermal aging. Therefore, the objective of this research work is to investigate the reliability performance of the conductive ink when subjected to hygrothermal aging. In this study, the samples were exposed to either the room temperature condition with temperature of 20°C and humidity of 60% RH and secondly when subjected to hygrothermal aging in an environmental chamber with humidity of 85% RH and a temperature of 85°C up to 24 hours. Following these, the samples were tested in terms of electrical conductivity using a four-point-probe (ASTM F390) and lap shear test (ASTM D1002) via tensile loading to evaluate the bonding strength at the interface between the adhesive and the substrate. Next, morphological study was done using Scanning Electron Microscopy (SEM). With the presence of water molecule in the conductive ink, the molecule of carbon black and epoxy become unstructured and traces of riverlines are evident. In addition, there is a dramatic decrease in the sheet resistance following hygrothermal aging relative to the samples conditioned at room temperature, possibly due to enhancement in the conductivity of the ink. In contrast, as for the mechanical shear stress, the lap shear stress following hygrothermal aging process becomes weaken compared to those conditioned at room temperature, which could be associated with weak surface energy, brittle and weak bonding between carbon black molecules and the aluminium substrate interface.

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Characterization of Adhesive-Bonded Sheet Metal Joints

Cited by 2 publications

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Experimental and numerical investigation of the effect of key joint variables on the static and fatigue performance of bonded metallic single-lap joints

Experimental and numerical investigation of the effect of key joint variables on the static and fatigue performance of bonded metallic single-lap joints

Reliability Performance of Conductive Ink Subjected to Hygrothermal Aging

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