Atomic layer deposition (ALD) technique at 300 °C was used to prepare an Al 2 O 3 dielectric layer, to form MOS-HFETs. The static (output and transfer) and dynamic (Capacitance-Voltage) characteristics were used for evaluation of investigated devices. From the static characteristic, an increase of the saturation drain current (up to 35%) and extrinsic transconductance (up to 10%) of the MOS-HFETs were observed. Higher n S on the MOS-structure, evaluated from the C-V measurement, can be responsible for these effects. The gate leakage current was also reduced about four orders of magnitude in comparison to the HFET.
IntroductionAlGaN/GaN heterostructure field effect transistors (HFETs), in which the polarizationinduced charge at the AlGaN/GaN interface allows for very high sheet electron densities n S (~1x10 13 cm -2 ) of 2-dimensional electron gas (2DEG) with no intentional doping, are characterized by very high carrier mobility in the channel ȝ (~1800 cm 2 /Vs), very high breakdown fields E C (~2.10 7 V/cm), unusual robustness and thermal capability of structures [1]. Thanks to the properties the HFETs based on the AlGaN/GaN heterostructure find wide range of applications in high frequency and high power electronics due to large breakdown voltage, large saturation electron velocity, and can operate in the high-temperature applications. HFETs have already been fabricated on SiC substrates with a f T of 181 GHz, and a f MAX of 186 GHz at a gate length of 30 nm [2], an output power density of 41.4 W/mm and a power-added efficiency (PAE) of 60% at 4 GHz [3]. The main obstacle to progress has been, and continues to be, reducing the trap densities in the bulk and surface of the materials and solving the problem of significant dispersion between DC and RF characteristics [4]. To address the gate lag effect, various solutions have been proposed to passivate the AlGaN surface. The next main problem of the AlGaN/GaN HFETs is a high gate leakage current due to a high density of defects in the structure. AlGaN/GaN metal-oxide-semiconductor HFETs (MOS-HFETs) using gate oxides such as Ga prepared at different deposition techniques (MOCVD, ALD, Sputtering and oxidation, etc.) offer lower gate leakage currents and larger voltage swings than conventional HFETs [5 -7]. The DC/RF disperssion is also reduced. However, the question of a suitable gate and passivation dielectrics and suitable deposition techniques are still open. The ALD technique has many advantages, such as low deposition temperature and good thickness controllability. Recently, improved transport properties and high microwave-noise performance of the ALD Al 2 O 3 /AlGaN/GaN MOS-HFETs have been reported [8].Aluminum oxide (Al 2 O 3 ) is an attractive material for use in the gate dielectric layer of MOSHFETs. Al 2 O 3 possesses a large band gap (9 eV), high dielectric constant (~9), high 978-1-4244-8575-8/10/$26.00 ©2010 IEEE