Characterization of dielectric properties and conductivity in encapsulation materials with high insulating filler contents

Abstract

The properties of different molding-compound materials with high filler contents have been investigated in order to assess their electrical properties. The experimental part of the present work has been focused on dielectric spectroscopy and steady-state conduction measurements. The results have been used to investigate the electrical properties of the materials at different frequencies, temperatures and electric fields. Differences in the relaxation kinetics with increasing filler content have been found, which can be ascribed to the larger interface regions between the filler particles. In addition, the extracted conductivities show a hopping transport and different activation energies on the temperature range from 20 ºC to 190 ºC.

Application and Suitability of Polymeric Materials as Insulators in Electrical Equipment

“…The issue with the epoxy/filler encapsulation is related to generating charge propagation over the surface of the ICs, due to the significant injection of electronic charge from the embedded bond wires [136]. The amount of filler in an epoxy molding compound varies the dielectric strength because at high temperatures for higher quantities of filler, the conductivity and electric field dependence increases [137]. This could be attributed to the consequent increment in the filler particles and the epoxy matrix [137].…”

“…The amount of filler in an epoxy molding compound varies the dielectric strength because at high temperatures for higher quantities of filler, the conductivity and electric field dependence increases [137]. This could be attributed to the consequent increment in the filler particles and the epoxy matrix [137].…”

Pathways for Alkali Ion Transport in Mold Compounds

“…Bulk molding compounds find application in electronics for example as encapsulation material in microelectronic devices. [6][7][8][9] For that specific application the compounds should exhibit high thermal conductivity, [10][11][12] low values of thermal expansion [13][14][15] and low dielectric constants [16][17][18] to avoid damage to the microelectronic device and optimize its operation.…”

“…Usually molding compounds are insulators and show low electric conductivity. 16 However, the conductivity may in general depend on the moisture [19][20][21] and water can be incorporated into the molding compound 22 such that the conduction properties may be influenced by the sample environment and history. As one aspect of electric conductivity, it is known that molding compounds can show a finite ionic conductivity.…”