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Molding compounds (MCs) have been used extensively as an encapsulation material for integrated circuits, however, MCs are susceptible to moisture and charge spreading over time.The increase in dissipation factor due to increase of parasitic electrical conductivity ( ) and the decrease in dielectric strength restrict their applications. Thus, a fundamental understanding of moisture transport will suggest strategies to suppress moisture diffusion and broaden their applications. In this paper, we 1) propose a generalized effective medium and solubility (GEMS) Langmuir model to quantify water uptake as a function of filler configuration and relative humidity; 2) investigate dominant impact of reacted-water on through numerical simulations, mass-uptake, and DC conductivity measurements; 3) investigate electric field distribution to explain how moisture ingress reduces ; and finally 4) optimize the filler configuration to lower the dissipation factor, and enhance .The GEMS-Langmuir model can be used for any application (e.g., photovoltaics, biosensors)where moisture diffusion leads to reliability challenges.

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The properties of different molding-compound materials with high filler contents have been investigated in order to assess their electrical properties. The experimental part of the present work has been focused on dielectric spectroscopy and steady-state conduction measurements. The results have been used to investigate the electrical properties of the materials at different frequencies, temperatures and electric fields. Differences in the relaxation kinetics with increasing filler content have been found, which can be ascribed to the larger interface regions between the filler particles. In addition, the extracted conductivities show a hopping transport and different activation energies on the temperature range from 20 ºC to 190 ºC.

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