Characterization of electroplated copper self-annealing with investigations focused on incorporated impurities

Stangl, M.; Acker, Jörg; Dittel, V.; Gruner, W.; Hoffmann, Volker; Wetzig, K.

doi:10.1016/j.mee.2005.07.059

Cited by 55 publications

(37 citation statements)

References 15 publications

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“…Although organic additives give uniform dense coatings, they remain as impurities in the deposited foils, reduce the deposit ductility and electrical conductivity, and cause grain growth with time, resulting in the deterioration of the mechanical properties. 27 The use of the PRED technique in additive-free electrolytes reduces impurities in the deposit and improves the properties due to lower residual stress, minimized adsorption of hydrogen species, and lower surface roughness. 28 Grain growth at room temperature is significantly reduced for copper films produced by PRED due to the reduced driving force for self-annealing compared to the films prepared by PED.…”

Section: Pulse Parameters Current Densitymentioning

confidence: 99%

Highly (111) Textured Copper Foils with High Hardness and High Electrical Conductivity by Pulse Reverse Electrodeposition

Sarada

Pavithra

Ramakrishna

et al. 2010

Electrochem. Solid-State Lett.

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The present article reports the pulse reverse electrodeposition of highly ͑111͒ textured freestanding copper foils, in an additive-free electrolyte, exhibiting hardness as high as 2.2-2.7 GPa with an electrical conductivity equal to that of bulk copper. The short anodic pulse applied and the absence of organic additives allowed the formation of highly dense foils with room-temperature stability in terms of mechanical and electrical properties. The process involves a fast electrodeposition method with a deposition rate of 25-50 m/h. The ͑111͒ texture and twin boundaries contribute to the high hardness and better electrical conductivity of the copper foils.

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Section: Pulse Parameters Current Densitymentioning

confidence: 99%

Highly (111) Textured Copper Foils with High Hardness and High Electrical Conductivity by Pulse Reverse Electrodeposition

Sarada

Pavithra

Ramakrishna

et al. 2010

Electrochem. Solid-State Lett.

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“…Recently, Burek et al developed a FIBless method to produce single-crystalline Cu nanopillars by electroplating Cu into an array of electron beam patterned holes in a Poly(methyl methacrylate) matrix [33]. Thin films of electroplated copper have been reported to contain trace amounts (.005% by weight) of carbon from the plating process [34]. Since these contaminations are very small, if at all present, we believe that their effect on the attained nanopillar strengths is likely negligible.…”

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confidence: 99%

Microstructure versus Size: Mechanical Properties of Electroplated Single Crystalline Cu Nanopillars

2010

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We report results of uniaxial compression experiments on single-crystalline Cu nanopillars with nonzero initial dislocation densities produced without focused ion beam (FIB). Remarkably, we find the same power-law size-driven strengthening as FIB-fabricated face-centered cubic micropillars. TEM analysis reveals that initial dislocation density in our FIB-less pillars and those produced by FIB are on the order of 10 14 m À2 suggesting that mechanical response of nanoscale crystals is a stronger function of initial microstructure than of size regardless of fabrication method.

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“…Prior to electrodeposition, a silver strike plated layer was deposited on the Cu plate to ensure adhesion between the Cu plate and the electrodeposited silver lm. The solution used for silver strike plating contained 5.5 g/L KAg(CN) 2 and 90 g/L KCN, and the solution temperature and current density were 18 C and 2 A/dm 2 , respectively. A stainless-steel plate was used for the anode.…”

Section: Methodsmentioning

confidence: 99%

“…A stainless-steel plate was used for the anode. A cyanide-based plating solution containing 148 g/L KAg(CN) 2 , 140 g/L KCN and 11 mg/L KSeCN was used for electrodeposition, and the solution temperature and current density were 18 C and 5 A/dm 2 , respectively. A pure silver plate was used for the anode.…”

Section: Methodsmentioning

confidence: 99%

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<i>In Situ</i> Observation of Self-Annealing Behaviors of (001)-Oriented Electrodeposited Silver Film by EBSD Method

et al. 2016

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The self-annealing behaviors of an electrodeposited silver lm preferentially oriented in the (001) direction were investigated by in situ electron backscatter diffraction pattern (EBSD) analysis. It was con rmed that there are ne grains with crystallite sizes of approximately 20 nm in an as-electrodeposited silver lm by X-ray diffraction (XRD) analysis. Self-annealing starts after storage for about 2 h at room temperature (R.T.) and recrystallization is almost complete after storage for 6 h. The area fraction of (001)-oriented grains rapidly increases after storage for about 2 h at R.T. and saturates in the range from 70% to 80% after storage for 6 h. In the initial stage of self-annealing, (001)-oriented and (212)-oriented recrystallized grains nucleate. Moreover, (001)-oriented grains mainly grow during subsequent storage.

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Characterization of electroplated copper self-annealing with investigations focused on incorporated impurities

Cited by 55 publications

References 15 publications

Highly (111) Textured Copper Foils with High Hardness and High Electrical Conductivity by Pulse Reverse Electrodeposition

Highly (111) Textured Copper Foils with High Hardness and High Electrical Conductivity by Pulse Reverse Electrodeposition

Microstructure versus Size: Mechanical Properties of Electroplated Single Crystalline Cu Nanopillars

<i>In Situ</i> Observation of Self-Annealing Behaviors of (001)-Oriented Electrodeposited Silver Film by EBSD Method

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