BiFeO 3 (BFO) and (Ba 0.5 , S r0.5 )TiO 3 (BST)-buffered BFO capacitors were deposited on Pt/Ti/SiO 2 /Si(100) substrates. The effect of the thickness of the BST buffer layer, which varied from 5 to 15 nm, and the structures and electrical properties were investigated. The structures, morphologies, and leakage currents are enhanced by the insertion of a BST buffer layer. As BST film thickness increases, the remnant polarizations (Pr) decreases and the polarization-electrical field (P-E) hysteresis curve changes. Retention properties were obtained only on BST-buffered BFO. In terms of retention behaviors, we found a more stretched exponential law dominated region during retention times with increasing BST film thickness. Attractive retention values of BST-buffered BFO are also shown.Ferroelectric thin films have attracted much attention due to their potential applications. One such application, ferroelectric random access memory (FeRAM), has many potentially attractive features such as non-volatility, low electric consumption, and high speed. 1 Recently, bismuth ferrite (BFO) has been one of the most interesting ferroelectric materials under investigation use in FeRAM. 2-4 BFO possesses a large polarization value and a low crystallization temperature, 5 both of which are desirable properties for high density FeRAMs. However, BFO has a high leakage current, which affects electric measurements of BFO films, such as polarization-electrical field (P-E) hysteresis, fatigue, and retention properties. Many studies have sought solutions to this problem via process modification, 4, 6 ion substitution, 5, 7 and insertion of a buffer layer. 8,9 With the use of oxide electrodes, the processing temperatures of the electrodes are usually high, 10, 11 which can degrade the leakage current characteristics of these films. However, the reliability can be improved. On the other hand, it is usually difficult to control the composition of doped BFO films with ion substitution. Insertion of buffer layers, such as PbTiO 3 , 12 (Ba x Sr 1−x )TiO 3 (BST), 12-14 Bi 4 Ti 3 O 12 -based, 8 and doped ferroelectric films, 9, 15 between the ferroelectric film and electrode has been reported to lower the crystallization temperature, improve the electric properties, reduce interdiffusion between the ferroelectric film and substrate, and suppress generation of defects.In this study, BST was chosen as the buffer layer for several reasons: (1) BST is similar to BFO in lattice and crystal structure; therefore, it will not introduce any additional chemical or processing complexity and can assist in the crystallization process of the BFO films; (2) BST is also expected to act as a sink for oxygen vacancies or defects in the buffer layer; (3) BST can block charge injection from the bottom electrode; and finally, (4) antiferroelectric films are reported 16 to have lower internal stress in comparison with ferroelectrics due to only a 180 • change in polarization direction during the antiferroelectric-ferroelectric switching. By using rf-magnetron sputterin...