Characterization of micro-crack propagation through analysis of edge effect in acoustic microimaging of microelectronic packages

Lee, Chean Shen; Zhang, Guangming; Harvey, David M.; Qi, Ailing

doi:10.1016/j.ndteint.2015.11.007

Cited by 18 publications

(10 citation statements)

References 9 publications

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“…The structure of a flip-chip package can be found from Ref. [32]. The measured signal contains three echoes.…”

Section: Ultrasonic Echo Estimation For Real Ultrasonic Nde Signalsmentioning

confidence: 99%

An artificial bee colony optimization based matching pursuit approach for ultrasonic echo estimation

Zhang

Dong

et al. 2018

Ultrasonics

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“…The structure of a flip-chip package can be found from Ref. [32]. The measured signal contains three echoes.…”

Section: Ultrasonic Echo Estimation For Real Ultrasonic Nde Signalsmentioning

confidence: 99%

An artificial bee colony optimization based matching pursuit approach for ultrasonic echo estimation

Zhang

Dong

et al. 2018

Ultrasonics

Self Cite

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“…The finite element model is developed with the commercial software (COMSOL Multiphysics 5.2), as shown in Figure 1. To overcome the huge computational resource requirements [20,21,22,23], we design a virtual transducer (VT) by reducing the size of the physical transducer (1/20 of the physical transducer) in the model, as shown in Figure 1a. The sizes of the coupling water zone and the thickness of the sample are also reduced.…”

Section: Point Spread Function (Psf)mentioning

confidence: 99%

“…It is hard to measure the PSF directly for high frequency transducer in AMI. Zhang et al developed a 2D AMI finite element model of a flip-chip package to investigate the acoustic propagation inside the package [20,21,22,23], while sparse reconstruction and super resolution were not involved.…”

Section: Introductionmentioning

confidence: 99%

Sparse Reconstruction for Micro Defect Detection in Acoustic Micro Imaging

Zhang

Shi

et al. 2016

Sensors

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Acoustic micro imaging has been proven to be sufficiently sensitive for micro defect detection. In this study, we propose a sparse reconstruction method for acoustic micro imaging. A finite element model with a micro defect is developed to emulate the physical scanning. Then we obtain the point spread function, a blur kernel for sparse reconstruction. We reconstruct deblurred images from the oversampled C-scan images based on l1-norm regularization, which can enhance the signal-to-noise ratio and improve the accuracy of micro defect detection. The method is further verified by experimental data. The results demonstrate that the sparse reconstruction is effective for micro defect detection in acoustic micro imaging.

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“…For ensuring the high reliability of internal connection, effective methods for non-destructively detecting the defects of flip chip are needed. A variety of techniques including X-ray microscopy [6], laser ultrasound [7], active infrared thermal imaging [8], vibration analysis [9], and AMI (acoustic micro imaging) [10][11][12] have been proven to be available for detecting the defects of interconnections in flip chip. X-ray detection technology has been widely used in non-destructive detection of defects; however, this method requires expensive equipment, generates harmful radiation to the human body, and needs experienced operators.…”

Section: Introductionmentioning

confidence: 99%

Simulation Research on Sparse Reconstruction for Defect Signals of Flip Chip Based on High-Frequency Ultrasound

Huang

Xie

et al. 2020

Applied Sciences

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Flip chip technology has been widely used in various fields. As the density of the solder balls in flip chip technology is increasing, the pitch among solder balls is narrowing, and the size effect is more significant. Therefore, the micro defects of the solder balls are more difficult to detect. In order to ensure the reliability of the flip chip, it is very important to detect and evaluate the micro defects of solder balls. High-frequency ultrasonic testing technology is an effective micro-defect detection method. In this paper, the interaction mechanism between high-frequency ultrasonic pulse and micro defects is analyzed by finite element simulation. A transient simulation model for the whole process of ultrasonic scanning of micro defects is established to simulate scanning in acoustic microscopy imaging. The acoustic propagation path map is obtained for analyzing acoustic energy transmission during detection, and the edge blurring effect in micro-defect imaging detection is clarified. The processing method of the time-domain signal and cross-section image signal of micro defects based on sparse reconstruction is studied, which can effectively improve the accuracy of detection and the signal-to-noise ratio.

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Characterization of micro-crack propagation through analysis of edge effect in acoustic microimaging of microelectronic packages

Cited by 18 publications

References 9 publications

An artificial bee colony optimization based matching pursuit approach for ultrasonic echo estimation

An artificial bee colony optimization based matching pursuit approach for ultrasonic echo estimation

Sparse Reconstruction for Micro Defect Detection in Acoustic Micro Imaging

Simulation Research on Sparse Reconstruction for Defect Signals of Flip Chip Based on High-Frequency Ultrasound

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