Sparse Reconstruction for Micro Defect Detection in Acoustic Micro Imaging

Zhang, Yichun; Shi, Tielin; Su, Lei; Wang, Xiao; Yuan, Hong; Chen, Kepeng; Liao, Guanglan

doi:10.3390/s16101773

Cited by 6 publications

(4 citation statements)

References 27 publications

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“…Consequently, there is always a compromise between the resolution and the penetration depth. There is an ongoing research to combine SAM and wave propagation modelling to better understand the trade-off between the resolution and the penetration depth [ 54 , 55 ].…”

Section: Ndt Methods For Ic Packagingmentioning

confidence: 99%

An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

Aryan

Sampath

Sohn

2018

Sensors

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The article provides a review of the state-of-art non-destructive testing (NDT) methods used for evaluation of integrated circuit (IC) packaging. The review identifies various types of the defects and the capabilities of most common NDT methods employed for defect detection. The main aim of this paper is to provide a detailed review on the common NDT methods for IC packaging addressing their principles of operation, advantages, limitations and suggestions for improvement. The current methods such as, X-ray, scanning acoustic microscopy (SAM), infrared thermography (IRT), magnetic current imaging (MCI) and surface acoustic waves (SAW) are explicitly reviewed. The uniqueness of the paper lies in comprehensive comparison of the current NDT methods, recommendations for the improvements, and introduction of new candidate NDT technologies, which can be adopted for IC packaging.

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Section: Ndt Methods For Ic Packagingmentioning

confidence: 99%

An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

Aryan

Sampath

Sohn

2018

Sensors

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“…The longitude wave velocity in water is 1480 m/s and shear wave velocity in steel is 3230 m/s. The excitation signal applied to the external circuit is a broadband modulated pulse, which can be modeled as a Gabor function [35]:…”

Section: Two-dimensional Rough Surface Model Setupmentioning

confidence: 99%

Effect of Surface Roughness on Ultrasonic Testing of Back-Surface Micro-Cracks

Wang

Cui

et al. 2018

Applied Sciences

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Surface roughness is one of the main factors that affect the ultrasonic testing of micro-cracks. This article theoretically analyzes the relationship between the changes in the energy intensity of crack echo waves and roughness-modified transmission coefficients. A series of simulations are carried out using two-dimensional sinusoidal curves as rough surface. Then, parallel experiments are performed on sample surfaces with different arithmetic average heights (Ra). The signal amplitude ratio factor (SARF) is defined to assess the ultrasonic detection capacity for micro-cracks. Both finite element analysis and experimental results show that signal amplitude decreases with an increase in Ra, resulting in signal-to-noise ratio loss. Amplitude attenuation caused by the rough back surface is less than that caused by the rough front surface. It is difficult to identify the signal of micro-cracks with a depth less than 400 μm when the Ra of the front surface is larger than 15 μm. Cracks with depths of more than 200 μm can be distinguished when the back-surface roughness is less than 24 μm. Furthermore, the amplitude of the micro-crack signal increases slightly with variation in the horizontal parameter (Rsm). This study provides a valuable reference for the precision evaluation of micro-cracks using ultrasonic inspection.

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“…Acanning acoustic microscopy, as a new detection technology, can penetrate the opaque materials of certain thickness such as metal, plastic, ceramics and biological tissues. It is likely for it to reckon the size and depth of defects based on the echo energy and time difference in order to accurately locate defects and provide strong support for subsequent analysis of product defects and quality improvement [8][9][10][11][12][13]. Elena Maeva made a detection on biotissue histology of breast cancer using 200MHz ultrasonic wave and found that the lateral resolution was less than 50μm [14].…”

Section: Introductionmentioning

confidence: 99%

Microstructure Size Measurement Based on C-scan Image of Scanning Acoustic Microscopy

Zhu¹,

Xu²,

Xiao³

et al. 2019

I2M

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The scanning acoustic microscopy system has a poor lateral resolution in the scan of microdefects within micro-devices. To solve the problem, this paper identifies the main influencing factors of the lateral size measuring accuracy of scanning acoustic microscopy, namely, Cscan image resolution and the lateral size measuring resolution. Then, the two kinds of resolutions were subjected to detailed analysis. After that, several micro-scale silicon wafers were prepared, and subjected to defect detection and size measurement by a high-frequency scanning acoustic microscopy system with a 300MHz high-frequency focused transducer. The measuring results show that the C-scan of the scanning acoustic microscopy system successfully recognized linear defects of 10μm and circular defect with a diameter of 16μm, and achieved a size measuring error no greater than 5.05 %; in addition, the measuring error is negatively correlated with the size of the wafer. Thus, the scanning acoustic microscopy system can measure small dimensions in an accurate manner.

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Sparse Reconstruction for Micro Defect Detection in Acoustic Micro Imaging

Cited by 6 publications

References 27 publications

An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

Effect of Surface Roughness on Ultrasonic Testing of Back-Surface Micro-Cracks

Microstructure Size Measurement Based on C-scan Image of Scanning Acoustic Microscopy

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