Characterization of Organic Contaminants Outgassed from Materials Used in Semiconductor Fabs/Processing

Abstract

As ULSI technology continues to advance, semiconductor manufacturers are facing new contamination control and monitoring challenges, including airborne molecular contamination (AMC). AMC is being recognized as one of the yield limiting factors in newer generation microelectronics fabrication processes. A major AMC source, materials' outgassing can introduce a variety of organic contaminants into semiconductor fabs, impacting many processes. This paper provides a brief overview of typical organic outgassing contaminants, their sources, process impacts and analytical techniques used to detect these species. In addition, outgassing study results for polycyclodimethylsiloxanes and several other contaminants using thermal desorption-gas chromatography-mass spectrometry (TD-GC-MS) analysis are employed to demonstrate the relationships among (1) outgassing level and outgassing time (linear), (2) outgassing quantity and the inverse of outgassing temperature (logarithmic), and (3) outgassing quantity and material surface area (linear). A new method, based on gas diffusion conductivity detection, for ammonia and volatile amines' outgassing analysis is also presented.Organic contaminants can affect semiconductor processing in a variety of ways. Tamaoki, et al.,

Cold curation of pristine astromaterials: Insights from the Tagish Lake meteorite

“…The sources of volatile contaminants in clean rooms and glove boxes are reasonably well known, and include filters, sealants, O‐rings, paints, adhesives, tiles, and packaging material, as well as laboratory consumables, such as garments, gloves, tape, cleaners, and reagents (Sun et al. ; Calaway et al. ).…”

“…The most problematic organic vapors released by these sources are polymer/plastics additives, such as styrene, phenol, methylstyrene, and phthalates, along with amines/ammonia and low boiling hydrocarbons (Sun et al. ). Many of these species may continue to be offgassed for several months after installation (Calaway et al.…”

“…The sources of volatile contaminants in clean rooms and glove boxes are reasonably well known, and include filters, sealants, O-rings, paints, adhesives, tiles, and packaging material, as well as laboratory consumables, such as garments, gloves, tape, cleaners, and reagents (Sun et al 2003;Calaway et al 2014). The most problematic organic vapors released by these sources are polymer/ plastics additives, such as styrene, phenol, methylstyrene, and phthalates, along with amines/ammonia and low boiling hydrocarbons (Sun et al 2003). Many of these species may continue to be offgassed for several months after installation (Calaway et al 2014).…”

Airborne molecular contamination: quality criterion for laser and optical components

“…Supplier of cleanrooms and mini-environments generally pre-qualify all materials used for the construction. [18][19][20] Due to the large surface, paints and flooring materials are well tested for their outgassing characteristic before usage. M+W issues product certificates for tested paints and flooring materials as well as for other materials and these data are collected in an internal data base for material selection.…”

Applications and Optoelectronic Methods of Detection of Ammonia

“…While ammonia gas is necessary for these processes, it is dangerous to people in excessive concentrations if inhaled, as anhydrous ammonia is corrosive (Close et al (1980)). Ammonia is also destructive when present in semiconductor fabrication facilities (Sun et al (2003)). For safety reasons and process monitoring applications, it is therefore important to monitor the concentrations of ammonia and optoelectronic methods can provide an accurate means of achieving this.…”