Characterization of packaging warpage, residual stress and their effects on the mechanical reliability of IGBT power modules

Sun, Wei; Wang, Lizhe; Zhu, Nan; Xin, Jiyuan; Luo, Yongxiang; Jiang, Xingrui; Fan, Guohua; Chen, Min

doi:10.1016/j.engfailanal.2023.107517

Cited by 6 publications

(3 citation statements)

References 46 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Attributable to factors like curing shrinkage during chemical reactions and a mismatch of thermal expansion coefficients between the resin and the substrate, epoxy resin generates residual stresses during curing. Resulting in material property degradation, it imparts a discernible influence on structural performance and potentially leads to device obsolescence [4][5][6]. In addition, epoxy resin is commonly used as the matrix of composite materials, and its related properties can affect the mechanical performance of composites.…”

Section: Introductionmentioning

confidence: 99%

Characterization of Potting Epoxy Resins Performance Parameters Based on a Viscoelastic Constitutive Model

Yang,

Ding,

et al. 2024

Polymers

View full text Add to dashboard Cite

To describe the evolution of residual stresses in epoxy resin during the curing process, a more detailed characterization of its viscoelastic properties is necessary. In this study, we have devised a simplified apparatus for assessing the viscoelastic properties of epoxy resin. This apparatus employs a confining cylinder to restrict the circumferential and radial deformations of the material. Following the application of load by the testing machine, the epoxy resin sample gradually reduces the gap between its surface and the inner wall of the confining cylinder, ultimately achieving full contact and establishing a continuous interface. By recording the circumferential stress–strain on the outer surface of the confining cylinder, we can deduce the variations in material bulk and shear moduli with time. This characterization spans eight temperature points surrounding the glass transition temperature, revealing the bulk and shear relaxation moduli of the epoxy resin. Throughout the experiments, the epoxy resin’s viscoelastic response demonstrated a pronounced time-temperature dependency. Below the glass transition temperature, the stress relaxation response progressively accelerated with increasing temperature, while beyond the glass transition temperature, the stress relaxation time underwent a substantial reduction. By applying the time-temperature superposition principle, it is possible to construct the relaxation master curves for the bulk and shear moduli of the epoxy resin. By fitting the data, we can obtain expressions for the constitutive model describing the viscoelastic behavior of the epoxy resin. In order to validate the reliability of the test results, a uniaxial tensile relaxation test was conducted on the epoxy resin casting body. The results show good agreement between the obtained uniaxial relaxation modulus curves and those derived from the bulk and shear relaxation modulus equations, confirming the validity of both the device design and the testing methodology.

show abstract

Section: Introductionmentioning

confidence: 99%

Characterization of Potting Epoxy Resins Performance Parameters Based on a Viscoelastic Constitutive Model

Yang,

Ding,

et al. 2024

Polymers

View full text Add to dashboard Cite

show abstract

“…With the development of science and technology, the degree of integration of electronic equipment is getting higher and higher. Heating power has increased rapidly [1,2], resulting in a sharp rise in heat source temperature [3,4]. Excessive temperature can cause the stress of the encapsulated structure to increase significantly.…”

Section: Introductionmentioning

confidence: 99%

“…Xu et al [10] found that under high temperature conditions, the fatigue life of three-dimensional stacked packaging structures rapidly declines. Wei et al [3] found that higher stress causes the deformation of an insulated gate bipolar transistor (IGBT) structure to reach 450 µm.…”

Section: Introductionmentioning

confidence: 99%

Simulation Study on Temperature and Stress and Deformation on Encapsulated Surfaces under Spray Cooling

Peng,

Niu,

Zhu

et al. 2024

Energies

View full text Add to dashboard Cite

Spray cooling is an effective heat dissipation technology and is widely used in the heat dissipation of encapsulated structures, but most of the research has only focused on the heat transfer performance itself and has lacked the analysis of surface stress and deformation. In this paper, a thermal stress coupling model was established under spray conditions, and the influence of spray parameters such as the spray height, spray flow, and nozzle inclination on heat transfer, surface stress, and deformation were studied. The result indicated that the lower the surface temperature, the smaller the stress and deformation. What is more, there was an optimal spray height (15 mm) to achieve the best heat transfer, and the surface stress and deformation were also minimal at the same time which the values were 28.97 MPa and 4.24 × 10−3 mm, respectively. The larger the spray flow rate, the better the heat transfer effect and the smaller the surface stress and deformation. When the spray flow rate was 24.480 L/h, the minimum values of surface stress and deformation were 25.42 MPa and 3.89 × 10−3 mm, respectively. The uniformity of surface stress distribution could be effectively improved with the increase in flow rate. Compared to 10 and 15 degree nozzle inclination, when the nozzle was perpendicular to the cooling surface, the surface stress and deformation were minimal.

show abstract

Electrodeposition of 15 μm Nanotwinned Cu foils with Low Warpage and Excellent Mechanical Properties

Huang,

Liu,

Chen

et al. 2024

Journal of Alloys and Compounds

View full text Add to dashboard Cite

Characterization of packaging warpage, residual stress and their effects on the mechanical reliability of IGBT power modules

Cited by 6 publications

References 46 publications

Characterization of Potting Epoxy Resins Performance Parameters Based on a Viscoelastic Constitutive Model

Characterization of Potting Epoxy Resins Performance Parameters Based on a Viscoelastic Constitutive Model

Simulation Study on Temperature and Stress and Deformation on Encapsulated Surfaces under Spray Cooling

Electrodeposition of 15 μm Nanotwinned Cu foils with Low Warpage and Excellent Mechanical Properties

Contact Info

Product

Resources

About