Characterization of polymeric encapsulation for implantable microsystems applying dynamic fluidic and electrical load

Schubert, M.; Kirsten, Sabine; Voitsekhivska, Tetiana; Bock, Karlheinz

doi:10.1109/isse.2015.7247976

Cited by 4 publications

(2 citation statements)

References 8 publications

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“…There is a noticeable trend toward the use of ALD as a preferred encapsulation material. In the past, the literature has addressed coatings on rigid materials, ,, but the application is clearly evolving toward flexible and polymer-based substrates. − Kim et al recently showed a polymer-inorganic hybrid encapsulation approach for flexible organic light-emitting diode displays that reveals low water vapor transmission rate (WVTR) values and stability under folding and storage tests . In terms of a biomedical application, the combination of continuous cyclic bending of encapsulated ultrathin flexible 3D structures in an environment that mimics the conditions found in the human body is rarely found in the literature, and it is intended here to fill this gap.…”

Section: Introductionmentioning

confidence: 99%

Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al₂O₃–TiO₂ Nanolaminates

Passlack

Simon

Bucher³

et al. 2023

ACS Appl. Mater. Interfaces

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Plasma-enhanced atomic layer deposition (PEALD) is utilized to improve the barrier properties of an organic chip-film patch (CFP) when it is used as an implant to prevent moisture and ions from migrating into the embedded electronic circuits. For this purpose, surface condition and material properties of eight modifications of Al 2 O 3 −TiO 2 nanolaminates sequentially deposited on polyimide PI-2611 films are evaluated in detail. The effect of stress-induced warpage of the deposited Al 2 O 3 −TiO 2 on the wafer level is calculated with the Stoney equation and reveals higher tensile stress values while increasing the thickness of Al 2 O 3 −TiO 2 nanolaminates from 20 up to 80 nm. Contact angle measurement and atomic force microscopy are used to investigate the surface energy and wettability, as well as the surface morphology of polyimide−Al 2 O 3 −TiO 2 interfaces. We show that plasma treatment of pristine polyimide leads to an enhanced adhesion force of the PEALdeposited layer by a factor of 1.3. The water vapor transmission rate (WVTR) is determined by exposing the coated polyimide films to 85% humidity and 23 °C and yields down to 1.58 × 10 −3 g(H 2 O)/(m 2 d). The data obtained are compared with alternative coating processes using the polymers parylene-C and benzocyclobutene (BCB). The latter shows higher WVTR values of 1.2 × 10 −1 and 1.7 × 10 −1 g(H 2 O)/(m 2 d) compared to the PEALD−PI-2611 systems, indicating lower barrier properties. Two Al 2 O 3 −TiO 2 modifications with low WVTR values have been chosen for encapsulating the CFP substrates and exposing them in a long-time experiment to chemical and mechanical loads in a chamber filled with phosphatebuffered saline at 37 °C, pH 7.3, and a cyclically applied pressure of 160 mbar (∼120 mm Hg). The electrical leakage behavior of the CFP systems is measured and reveals reliable electrical long-term stability far beyond 11 months, highlighting the great potential of PEALD-encapsulated CFPs.

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Section: Introductionmentioning

confidence: 99%

Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al₂O₃–TiO₂ Nanolaminates

Passlack

Simon

Bucher³

et al. 2023

ACS Appl. Mater. Interfaces

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“…This outstanding set of properties make polyimide suitable for a variety of applications ranging from electronics, medicine, membrane separation to aerospace and military industries [81,84]. Certain types of biocompatible polyimides are widely used in the packaging of implantable electronics and electrodes not only for its barrier performance [85][86][87][88][89][90][91][92][93] but also for its compatibility with microfabrication processes, being used as a structural component of devices [94][95][96][97].…”

Section: Introductionmentioning

confidence: 99%

Investigating the Nucleation of AlOx and HfOx ALD on Polyimide: Influence of Plasma Activation

et al. 2021

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There is an increasing interest in atomic layer deposition (ALD) on polymers for the development of membranes, electronics, (3D) nanostructures and specially for the development of hermetic packaging of the new generation of flexible implantable micro-devices. This evolution demands a better understanding of the ALD nucleation process on polymers, which has not been reported in a visual way. Herein, a visual study of ALD nucleation on polymers is presented, based on the different dry etching speeds between polymers (fast) and metal oxides (slow). An etching process removes the polyimide with the nucleating ALD acting as a mask, making the nucleation features visible through secondary electron microscopy analyses. The nucleation of both Al2O3 and HfO2 on polyimide was investigated. Both materials followed an island-coalescence nucleation. First, local islands formed, progressively coalescing into filaments, which connected and formed meshes. These meshes evolved into porous layers that eventually grew to a full layer, marking the end of the nucleation. Cross-sections were analyzed, observing no sub-surface growth. This approach was used to evaluate the influence of plasma-activating polyimide on the nucleation. Plasma-induced oxygen functionalities provided additional surface reactive sites for the ALD precursors to adsorb and start the nucleation. The presented nucleation study proved to be a straightforward and simple way to evaluate ALD nucleation on polymers.

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A low-power implantable neurostimulator for small rodents with functional validation

Wright

Wong

Chang

et al. 2019

2019 IEEE Biomedical Circuits and Systems Conference (BioCAS)

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Characterization of polymeric encapsulation for implantable microsystems applying dynamic fluidic and electrical load

Cited by 4 publications

References 8 publications

Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al₂O₃–TiO₂ Nanolaminates

Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al₂O₃–TiO₂ Nanolaminates

Investigating the Nucleation of AlOx and HfOx ALD on Polyimide: Influence of Plasma Activation

A low-power implantable neurostimulator for small rodents with functional validation

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Characterization of polymeric encapsulation for implantable microsystems applying dynamic fluidic and electrical load

Cited by 4 publications

References 8 publications

Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al2O3–TiO2 Nanolaminates

Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al2O3–TiO2 Nanolaminates

Investigating the Nucleation of AlOx and HfOx ALD on Polyimide: Influence of Plasma Activation

A low-power implantable neurostimulator for small rodents with functional validation

Contact Info

Product

Resources

About

Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al₂O₃–TiO₂ Nanolaminates

Flexible Ultrathin Chip-Film Patch for Electronic Component Integration and Encapsulation using Atomic Layer-Deposited Al₂O₃–TiO₂ Nanolaminates