2019 IEEE Biomedical Circuits and Systems Conference (BioCAS) 2019
DOI: 10.1109/biocas.2019.8919215
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A low-power implantable neurostimulator for small rodents with functional validation

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Cited by 5 publications
(4 citation statements)
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“…One approach to combat this is to combine different layers to benefit from the strengths of each. Popular polymers include Parylene-C (Loeb et al, 1977 ), epoxies (Wright et al, 2019 ), and liquid crystal polymers (LCPs) (Gwon et al, 2016 ). From a high-level system design approach, it is important to recognize that implants for small animals do not need to last for decades, so a semi-hermetic approach using polymers may meet experimental requirements (Boeser et al, 2016 ).…”
Section: Technical Challengesmentioning
confidence: 99%
“…One approach to combat this is to combine different layers to benefit from the strengths of each. Popular polymers include Parylene-C (Loeb et al, 1977 ), epoxies (Wright et al, 2019 ), and liquid crystal polymers (LCPs) (Gwon et al, 2016 ). From a high-level system design approach, it is important to recognize that implants for small animals do not need to last for decades, so a semi-hermetic approach using polymers may meet experimental requirements (Boeser et al, 2016 ).…”
Section: Technical Challengesmentioning
confidence: 99%
“…Neural circuits with roles in the broad spectrum of diseases are constantly being identified and targeted by bioelectronics for therapeutic benefit in pre-clinical settings (Tsaava et al 2020). One of the major active areas for development is the ability to perform chronic stimulation in rodent models (Wright et al 2019;Mughrabi et al 2021), allowing the leveraging of the myriad of disease models into BEM therapy discovery. Understanding the anatomical differences among rodents, pigs and humans will help to refine current neuromodulation approaches, establish a pathway for translation from rodents to larger models, and drive future successful clinical trials.…”
Section: Summary and Future Directionsmentioning
confidence: 99%
“…Silicone encapsulation is appealing because it is compliant and can be used to minimize the foreign body response to the implant, however it suffers from similar issues as Parylene including moisture absorption and poor adhesion to underlying materials such as insulated wires leading to electrodes. Another approach to polymer-based packaging has been to incorporate layers of different polymers such as Parylene and epoxy (Wright et al 2019) to try to benefit from the different properties of the different materials, but the addition of additional encapsulation layers and the resulting added thickness can result in higher acoustical impedance and lower power transfer efficiency for ultrasound powered devices.…”
Section: Encapsulation Strategiesmentioning
confidence: 99%