Characterization of printed solder paste excess and bridge related defects

International Journal of Computer Integrated Manufacturing

et al. 2013

Product life-cycle reduction, hazardous substance utilisation, waste generation and resource utilisation -among other sustainably issues -are becoming a growing concern for electronics manufactures in the UK; with tighter measures not only over what materials can be used, but also on waste production and energy utilisation. This paper discusses extensions on a tool developed by the Loughborough University to include the evaluation of sustainable phenomena during production, thus supporting more sustainable production in the electronics manufacturing domain. The tool supports the optimisation of process and product design in advance of production runs in order to support a 'right first time' approach to manufacturing, whilst meeting both quality and customer requirements. The main contributions are (1) providing a simulation tool to approach sustainable aspects of business based on specific user priorities in the area, (2) demonstrating the tool on a real case study developed under industrial constraints and conditions and (3) providing a tool that can evolve along with the rapidly changing sustainability requirements in the application domain. The tool is presented, in this paper, along with its integrated modelling framework. The study contains results derived from an industry-based case study, designed to represent both the functionality and potential of the developed tool. The case study and the analysis have a focus on sustainable impacts due to poor quality.

Section: Modelling and Simulation To Enable Predictive Capabilitymentioning

confidence: 99%

Sustainable production in the UK: a tool to support printed circuit assembly (PCA) manufacturing

Huertas

Rosamond

International Journal of Computer Integrated Manufacturing

et al. 2013

“…(b) Stencil/PCB alignment model. This model has been previously described in detail by the authors [50] (Fig. 11).…”

Section: Componentmentioning

confidence: 99%

“…Transfer ratios that are greater than 100 per cent, assuming coplanar contact between (a) squeegee and stencil and (b) stencil and PCB, could be explained by a loss of aperture/SMT pad gasket seals [50]. Lateral misalignment would be the most likely root cause in circumstances where excessive solder joints coincide with localized concentrations of excess deposit resulting in short circuits.…”

Section: Componentmentioning

confidence: 99%

A database system for decision support in low-volume electronics assembly

Segura-Velandia

West

Proceedings of the Institution of Mechanical Engineers, Part B:

2011

The development of accurate database systems is fundamental for the support of any software, especially in knowledge-and data-driven applications. The paper presents a database system developed to support an integrated modelling framework definition for printed circuit board (PCB) assembly that can provide decision support to business processes throughout the product and process life cycle. Specifically, by adopting an integrated modelling framework within the PCB assembly manufacturing, complete and realistic data information models were obtained and organized using a relational database management system implemented in Structured Query Language. This database system in turn supports a set of software applications implemented as part of a decision support framework, in this case known as CLOVES (Complex Low Volume Electronics Simulation). The underlying database is open, extensible, and has the ability to be configurable by original equipment manufacturers and contract electronics manufacturers to update their materials, processes, and rules. Integration to a company's enterprise resource planning system and its deployment in quality, simulation, and failure analyses call for the improvement of electronics manufacturing industry data-exchange practices.

“…In low volume electronics manufacturing and assembly, several type of failure models have been proposed in the literature [35]. These failure models are described at various product levels e.g.…”

Section: Failure Modellingmentioning

confidence: 99%

“…Previous publications from the authors describe details on the method used to integrate these physical models [35]. For each surface mount process (printing, placement and reflow), a failure or combination of failure models was obtained to model the cause and effects for solder bridges, chip flotation; tomb-stoning and mid-chip solder balls.…”

Section: Surface Mount Process Failure Modelsmentioning

confidence: 99%

Combining business process and failure modelling to increase yield in electronics manufacturing

Segura-Velandia

Proceedings of the Institution of Mechanical Engineers, Part B:

Monfared

et al. 2010

The prediction and capturing of defects in low-volume assembly of electronics is a technical challenge that is a prerequisite for design for manufacturing (DfM) and business process improvement (BPI) to increase first-time yields and reduce production costs. Failures at the component-level (component defects) and system-level (such as defects in design and manufacturing) have not been incorporated in combined prediction models. BPI efforts should have predictive capability while supporting flexible production and changes in business models. This research was aimed at the integration of enterprise modelling (EM) and failure models (FM) to support business decision making by predicting system-level defects. An enhanced business modelling approach which provides a set of accessible failure models at a given business process level is presented in this article. This model-driven approach allows the evaluation of product and process performance and hence feedback to design and manufacturing activities hence improving first-time yield and product quality. A case in low-volume, high-complexity electronics assembly industry shows how the approach leverages standard modelling techniques and facilitates the understanding of the causes of poor manufacturing performance using a set of surface mount technology (SMT) process failure models. A prototype application tool was developed and tested in a collaborator site to evaluate the integration of business process models with the execution entities, such as software tools, business database, and simulation engines. The proposed concept was tested for the defect data collection and prediction in the described case study.