Volume 13: Vibration, Acoustics and Wave Propagation 2014
DOI: 10.1115/imece2014-38279
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Characterization of the Damping Behavior of Thin Films With Dynamic Mechanic Analysis in Bending Mode

Abstract: Usually damped structures, consisting of a constrained layer damping (CLD) and free layer damping (FLD) design, are characterized via dynamic mechanic analysis (DMA) in bending mode. Since laminates with thicknesses from 10 to 100 μm exhibit a very low bending stiffness it isn’t possible to determine their damping properties in bending mode with standard DMA setups. Therefore in the present work the main objective was to introduce a new method to overcome this drawback. Two main geometries were … Show more

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