2014
DOI: 10.1088/1757-899x/63/1/012135
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Characterization of ultrafine grained Cu-Ni-Si alloys by electron backscatter diffraction

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Cited by 10 publications
(16 citation statements)
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“…Backscatter (ECCI, electron channeling contrast imaging) electron microscopy [11,12] was carried out using an AsB (Angle Selective Detector, Zeiss, Oberkochen, Germany) [13] in a Zeiss ULTRA scanning electron microscope (SEM, Zeiss, Oberkochen, Germany) equipped with a thermal field emission cathode. Typically, an aperture lens of 120 µm and acceleration voltages of 15-20 kV at a working distance of 2-6 mm were used.…”
Section: Methodsmentioning
confidence: 99%
“…Backscatter (ECCI, electron channeling contrast imaging) electron microscopy [11,12] was carried out using an AsB (Angle Selective Detector, Zeiss, Oberkochen, Germany) [13] in a Zeiss ULTRA scanning electron microscope (SEM, Zeiss, Oberkochen, Germany) equipped with a thermal field emission cathode. Typically, an aperture lens of 120 µm and acceleration voltages of 15-20 kV at a working distance of 2-6 mm were used.…”
Section: Methodsmentioning
confidence: 99%
“…Thus Cu-Ni-Si materials with very fine grain sizes in the range 0,2-2 µm can be produced. EBSD and electron channeling contrast in the SEM are very helpful tools to characterize such microstructures [11]. Swaging and accumulative roll bonding, typically lead to a maximum hardness at a logarithmic strain or deformation degree of 2.5 and 5, respectively.…”
Section: Discussionmentioning
confidence: 99%
“…Wider possibilities for reaching preferred mechanical properties and electric conductivity can be achieved in these alloys by application of technologies of cold deformation and in combination with different variants of supersaturation and ageing processes [7][8][9][10][11][12]. In recent years, processes that use strong and complex plastic deformation (i.e.…”
Section: Introductionmentioning
confidence: 99%
“…In recent years, processes that use strong and complex plastic deformation (i.e. SPD -severe plastic deformation) are becoming widely used in manufacturing [2,[10][11][12]. These processes are widely used in production of components of pure copper and solution strengthened copper but there are not much studies of fabrication of components from precipitation hardened copper alloys.…”
Section: Introductionmentioning
confidence: 99%