2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) 2019
DOI: 10.1109/itherm.2019.8756500
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Characterization of Viscoelastic Response of Underfill Materials

Promod R. Chowdhury
1
,
Jeffrey C. Suhling
2
,
Pradeep Lall
3
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Cited by 8 publications
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References 12 publications
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Evolution of Viscoelastic Properties and Interface-Fracture Toughness Under Sustained High Temperature Operation Typical of Automotive Underhood for up to 1-year

Lall
1
,
Zhang
2
,
Kasturi
3
et al. 2021
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
9
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0
0
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Evolution of Viscoelastic Properties and Interface-Fracture Toughness Under Sustained High Temperature Operation Typical of Automotive Underhood for up to 1-year

Lall
1
,
Zhang
2
,
Kasturi
3
et al. 2021
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
9
0
0
0
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Characterization and Verification of Viscoelastic Constitutive Parameters of Underfill Material

Zhong
1
,
Li
2
,
Lu
3
et al. 2021
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
6
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Viscoelastic Characterization and Simulation of Thermal Interface Materials

Zhong
1
,
Li
2
,
Lu
3
et al. 2021
2021 22nd International Conference on Electronic Packaging Technology (ICEPT)
4
0
0
0
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