Characterization of water vapor plasma‐modified polyimide

Abstract

SYNOPSISTo enhance polyimide-to-polyimide adhesion, we have investigated the effect of surface modification in water vapor plasma. The use of a water vapor plasma to treat a fully cured polyimide ( PMDA-ODA) surface before subsequent layers of polyimide are applied results in dramatically enhanced interfacial adhesion. The polyimide-to-polyimide interfacial adhesion strength attained following water vapor plasma treatment exceeds the cohesive strength of the applied polyimide layer. The effect of surface modification in water vapor plasma on metal-to-polyimide adhesion has also been investigated. The use of a water vapor plasma to treat a fully cured polyimide (PMDA-ODA) surface prior to metallization results in increased metal-to-polymer interfacial adhesion. A study of both electroless and vacuum-deposited metal was conducted. The use of contact-angle measurements, peel tests, Fourier transform infrared spectroscopy, optical emission spectroscopy, nuclear forward scattering, and X-ray photoelectron spectroscopy has led us to a preliminary understanding of the resulting surface modification and the subsequent effect of adhesion promotion.

Copper/Polyimide Heterojunctions: Controlling Interfacial Structures Through an Additive‐Based, All‐Wet Chemical Process Using Ion‐Doped Precursors

“…1 kgf cm -1 in samples reduced above 40°C. This maximum value is comparable or higher than that of other copper/ polyimide system reported previously [14,16,[19][20][21][22] and can be suitable for PCB applications. Note that the interface between polyimide and copper prepared at higher temperatures (> 40°C) showed densely-packed granular structures, whereas lower temperatures yielded relatively large copper particles at the interface.…”

“…face roughness of the polyimide surface, which is initially formed via alkali or plasma etching treatment before metal deposition, or through a intermediate adhesive layers between copper and underlying polyimide. [13][14][15][16][17][18][19][20][21][22] However, it would be difficult to employ the microscale anchoring system for the fabrication of minute, sub-micrometer copper wiring despite the increasing demand for highly integrated, minute copper wiring to propagate radiofrequency electric current. Thus, the development of a novel adhesion scheme for the "direct" copper/polyimide heterojunction that does not rely on surface roughness remains a great challenge.…”

Group Contribution Method for the Estimation of Contact Angle Trends on Modified Polymer Surfaces

“…By relating Eqs. [1], [2], and [3], the number of ionizable carboxylic acid groups per unit surface area can be estimated. A subsequent study demonstrated the ability of this technique to follow kinetics of alkaline hydrolysis on PMDA-ODA surfaces (7).…”

“…Modification of polyimide surfaces has been studied by a number of researchers (1)(2)(3)(4)(5)(6)(7)(8)(9)(10). Polyimides are used widely in the electronics industry as an interlayer dielectric and alignment layers for liquid crystals (11)(12)(13).…”

Chemical Binding of Unsaturated Fluorenes to Poly(2‐chloroxylylene) Thin Films

“…The dry methods typically use an arc discharge (capacitively coupled plasma) or a microwave plasma with various chemicals, i.e., H 2 O, [1][2][3][4] NH 3 , [2] Na 2 S, [5] etc. Solution-borne processes typically use aggressive oxidizing reagents, such as H 2 CrO 4 /H 2 SO 4 , [6] fuming H 2 SO 4 , [7] etc.…”