“…However, ceramic materials are not flexible and are used as substrate materials in ceramic leadless chip carriers (LCCs) , that have a relatively low relative permittivity and a high dielectric constant because they are composed of materials with larger molecular weights than that of polymers. Thus, numerous polymer–ceramic composites have been considered. − Recently, glass–ceramics such as indialite and cordierite, H 3 BO 3 , ErNbO 4 , and Li 3 AlB 2 O 6 have successfully reduced the relative permittivity of ceramics to 2–4, which is challenging for ceramics. Ceramics have a relatively high degree of freedom owing to their compositional and structural diversity of elements compared with that in polymeric materials.…”