Characterizing EMI-filters’ Deviations caused by the Capacitors Ageing based on Complex Impedance Analysis

Líu, Hao; Claeys, Tim; Pissoort, Davy; Vandenbosch, Guy A. E.

doi:10.1109/emceurope48519.2020.9245776

Cited by 3 publications

(2 citation statements)

References 10 publications

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“…To investigate the impact of aging on the emission and IB of ICs, accelerated life tests are usually performed in industry. High-level stress conditions, such as extreme high temperature or voltage, are applied for a short period of time to accelerate the damage rate for relevant wear-out failure mechanisms, such as NBTI and HCI [45]. The most frequently used accelerated tests to induce such degradation mechanisms are high-and low-temperature operating life tests [46] and temperature humidity bias (THB) test [47].…”

Section: Aging Of Icsmentioning

confidence: 99%

Validation of IC Conducted Emission and Immunity Models Including Aging and Thermal Stress

Khan

Koohestani

Levant³

et al. 2023

IEEE Trans. Electromagn. Compat.

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Environmental factors, such as aging and thermal stress, can seriously impact the electromagnetic compatibility behavior of an integrated circuit (IC). The standardized IC emission model for conducted emission (ICEM-CE) and IC immunity model for conducted immunity (ICIM-CI) can be used in industry to predict electromagnetic behavior at the IC and the printed circuit board level. However, these do not take into account the effect of aging and extreme temperature variations. In this article, a custom IC designed in silicon-on-insulator technology, containing several independent analog blocks, is used to characterize the influence of aging and temperature on conducted emission and immunity through measurements and transistor-level simulations. The highly accelerated temperature and humidity stress test (HAST) was performed to evaluate aging and its influence on IC parameters. The results show that the passive distribution network is only influenced by thermal stress and not HAST aging. The latter mainly affects the active elements in the IC and reduces the conducted emission and immunity levels through intrinsic permanent degradation mechanisms. Furthermore, thermal stress mainly causes drifts in the transistor characteristics (such as threshold voltage and effective mobility), which affect the conducted emission and immunity levels and resulting in soft failures. All drifts/tolerances collected from measurements and simulations are characterized in a way that makes it possible to include them in potential future versions of the ICEM-CE and ICIM-CI standards. Index Terms-Highly accelerated temperature and humidity stress test (HAST) aging, integrated circuit (IC), integrated circuit emission model for conducted emission (ICEM-CE), integrated circuit immunity model for conducted immunity (ICIM-CI), thermal stress.

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Section: Aging Of Icsmentioning

confidence: 99%

Validation of IC Conducted Emission and Immunity Models Including Aging and Thermal Stress

Khan

Koohestani

Levant³

et al. 2023

IEEE Trans. Electromagn. Compat.

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“…However, EMC testing during or after environmental stress of the full system presents an added cost, which is often considered excessive. Instead, subassemblies like EM interference (EMI) filters have been tested and characterized [7]. To this date, publications about aging of shielded cables have focused on testing of the cable dielectric performance parameters like insulation breakdown voltage and relative permittivity [8].…”

Section: Introductionmentioning

confidence: 99%

Including Experimental Aging of Shielded Cables into Bulk Current Injection Simulations

Leppaaho

Lafon

Ferreri

et al. 2022

2022 International Symposium on Electromagnetic Compatibility – EMC Europe

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Transfer impedance of shielded cables is a main characteristic to describe cable shielding performance at least up to 1 GHz. Traditionally, a cable shield consists of a braid, a foil, or a combination of them. Braids have attracted a significant amount of research interest, while foils have not. Published studies have concentrated on cable shielding performance when cables are new. In this paper, a highly accelerated aging method for shielded cables is presented and applied to a cable made up of a combination of a braid and foil shield. Finally, the effect of aging on system performance during bulk current injection (BCI) tests is assessed by circuit simulation.

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A High-Efficiency Online Monitoring Strategy for DC-Link Capacitors of Multistring DC/DC Converters in Photovoltaic Applications

Lu,

Yin,

Zheng

et al. 2024

IEEE Trans. Ind. Electron.

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Characterizing EMI-filters’ Deviations caused by the Capacitors Ageing based on Complex Impedance Analysis

Cited by 3 publications

References 10 publications

Validation of IC Conducted Emission and Immunity Models Including Aging and Thermal Stress

Validation of IC Conducted Emission and Immunity Models Including Aging and Thermal Stress

Including Experimental Aging of Shielded Cables into Bulk Current Injection Simulations

A High-Efficiency Online Monitoring Strategy for DC-Link Capacitors of Multistring DC/DC Converters in Photovoltaic Applications

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