Chemical and electrical characterisation of the segregation of Al from a CuAl alloy (90%:10% wt) with thermal anneal

Byrne, Conor; Brady, A. P.; Walsh, Lee A.; McCoy, Anthony; Bogan, J.; McGlynn, Enda; Rajani, K V; Hughes, Greg

doi:10.1016/j.tsf.2015.12.056

Cited by 5 publications

(1 citation statement)

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“…Therefore, improving the surface oxidation resistance has been one of the core topics in the study of metallic materials for decades [7,8]. Generally, enhancing the surface oxidation resistance of metals can be achieved by tailoring the surface crystallography [9,10], alloying the surface [11,12] or introducing surface coatings [13,14]. Compared with other strategies, surface coatings can physically isolate the metal surface from the oxygen environment, thereby significantly enhancing surface oxidation resistance.…”

Section: Introductionmentioning

confidence: 99%

Effect of Copper Surface Roughness on the High-Temperature Structural Stability of Single-Layer-Graphene

Yao,

Zhong,

Guo

et al. 2024

Materials

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Graphene (Gr) has shown great potential in the field of oxidation protection for metals. However, numerous studies have shown that Gr will suffer structural degradation on metal surface during high-temperature oxidation, which significantly limited the effectiveness of their oxidation protection. Therefore, understanding the degradation mechanism of Gr is of great interest to enhance their structural stability. Here, the effect of copper (Cu) surface roughness on the high-temperature structural stability of single-layer graphene (SLG) was examined using Cu covered with SLG as a model material. SLG/Cu with different roughness values was obtained via high-temperature annealing of the model material. After high-temperature oxidation at 500 °C, Raman spectra analysis showed that the defect density of the oxidized SLG increased from 41% to 81% when the surface roughness varied from 37 nm to 81 nm. Combined with density functional theory calculations, it was found that the lower formation energy of the C-O bond on rough Cu surfaces (0.19 eV) promoted the formation of defects in SLG. This study may provide guidance for improving the effectiveness of SLG for the oxidation protection of metallic materials.

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