Thin-film analysis in the integrated circuit industry is essential for both process development and production control. In this respect, analysis by x-ray fluorescence spectrometry (XRF) is advantageous due to its precision and speed. XRF has been used to determine the thickness and elemental composition of thin films, including borophosphosilicate glass, titanium and amorphous-silicon multilayers, and aluminum alloys. Furthermore, XRF has been applied to solve contamination and corrosion problems, including the determination of chlorine and fluorine levels in aluminum-based metallizations after plasma etching.