The arrangement of various metals in a nanoalloy framework enables the alteration of chemical and physical properties. In this study, the structure, surface,composition and magnetic properties of a copper-nickel alloy thin film that was electrodeposited on a stainless steel substrate at -0.9V and 60 o C are examined. During the deposition of the bath temperature, chemical elements copper forms first, followed by the formation of a bimetallic copper-nickel alloy. A nickel-rich alloy that effectively resists oxidation covers the underlying copper. It was found that the copper-nickel films revealed a face-centered cubic structure with crystallites oriented along the (1 1 1) plane including crystallite size, micro-strain, dislocation density, and stacking fault probability. Morphological and film composition characteristics revealed that the deposited films were well adherent to the surface of the substrate with microcracks and stoichiometric ratio. The magnetic properties of the deposited films were estimated.