Chemical information from XPS—applications to the analysis of electrode surfaces

McIntyre, N. S.; Sunder, S.; Shoesmith, D.W.; Stanchell, F.W.

doi:10.1116/1.570934

Cited by 355 publications

(220 citation statements)

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“…The literature reports metallic Cu with a characteristic peak in the range of 918.2 to 918.6 eV; Cu 2 O has a reported peak between 916.0 and 916.4 eV, and the peak for the CuO standard increases from 917.6 to 917.8 eV. [49][50][51][52][53][54][55] The acid-treated Cu sheet resulted in spectra similar to those previously reported in the literature for air-oxidized metallic Cu. 54,55 This oxidized layer was reported to be in the size range of 1.6 to 2.7 nm.…”

Section: Structural Characterizationsupporting

confidence: 69%

“…The XPS spectra of the Cu 2p region are very challenging to interpret because the metallic state of Cu and Cu(I) have statistically similar binding energy values ( Figure S7a). [49][50][51][52][53][54][55] Hence, the X-ray generated Auger spectra were recorded in the Cu L 3 M 45 M 45 region, and the results are presented in Figure 7a. The literature reports metallic Cu with a characteristic peak in the range of 918.2 to 918.6 eV; Cu 2 O has a reported peak between 916.0 and 916.4 eV, and the peak for the CuO standard increases from 917.6 to 917.8 eV.…”

Section: Structural Characterizationmentioning

confidence: 99%

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Cu–Sn Bimetallic Catalyst for Selective Aqueous Electroreduction of CO₂ to CO

et al. 2016

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ABSTRACT. We report a selective and stable electrocatalyst utilizing non-noble metals consisting of Cu and Sn for the efficient and selective reduction of CO 2 to CO over a wide potential range. The bimetallic electrode was prepared through the electrodeposition of Sn species on the surface of oxide-derived copper (OD-Cu). The Cu surface, when decorated with an optimal amount of Sn, resulted in a Faradaic efficiency (FE) for CO greater than 90% and a current density of −1.0 mA cm −2 at −0.6 V vs. RHE, compared to the CO FE of 63% and −2.1 mA cm −2 for OD-Cu. Excess Sn on the surface caused H 2 evolution with a decreased current density. X-ray diffraction (XRD) suggests the formation of Cu-Sn alloy. Auger electron spectroscopy of the sample surface exhibits zero-valent Cu and Sn after the electrodeposition step. Density functional theory (DFT) calculations show that replacing a single Cu atom with a Sn atom leaves the d-band orbitals mostly unperturbed, signifying no dramatic shifts in the bulk electronic structure. However, the Sn atom discomposes the multi-fold sites on pure Cu, Page 1 of 37 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 2 disfavoring the adsorption of H and leaving the adsorption of CO relatively unperturbed. Our catalytic results along with DFT calculations indicate that the presence of Sn on reduced OD-Cu diminishes the hydrogenation capability-i.e., the selectivity towards H 2 and HCOOH-while hardly affecting the CO productivity. While the pristine monometallic surfaces (both Cu and Sn) fail to selectively reduce CO 2 , the Cu-Sn bimetallic electrocatalyst generates a surface that inhibits adsorbed H*, resulting in improved CO FE. This study presents a strategy to provide a low-cost non-noble metals that can be utilized as a highly selective electrocatalyst for the efficient aqueous reduction of CO 2 . ACS Paragon Plus Environment ACS Catalysis

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Section: Structural Characterizationsupporting

confidence: 69%

Section: Structural Characterizationmentioning

confidence: 99%

Cu–Sn Bimetallic Catalyst for Selective Aqueous Electroreduction of CO₂ to CO

et al. 2016

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“…+ complex ions (+0.38 V) are also formed during the preparation of the Ag precursor solution. 11,24,25) This decrease can improve the stability of the complex and reduces the likelihood of free Ag particles forming in the solution. 5,11) The SEM images and XRD results in Figs.…”

Section: Resultsmentioning

confidence: 99%

Resistance to Oxidation at 150℃ of Sub-Micrometer Diameter Silver-Coated Copper Particles Produced by Wet Chemical Synthesis and Immersion Plating

Shin

Lee

2017

Mater. Trans.

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Sub-micrometer diameter Cu particles fabricated in air by wet synthesis at 80 C for 2 h were immersion plated with Ag to produce an inexpensive conductive paste ller aimed at achieving ne printed patterns. Increasing the volume ratio of hydrazine hydrate to ammonium hydroxide used during wet synthesis was found to accelerate the rate of reduction and increase the yield of Cu particles to as much as 97.56% when an optimal ratio of 3:7 was used. The resulting particles (average size = 0.56 μm) exhibited excellent dispersion, with the use of an optimal Ag concentration of 15 mass% in their subsequent immersion plating producing a continuous Ag shell and a 0.62 μm average diameter. Increasing the Ag concentration beyond this, however, resulted in abrupt agglomeration between the particles, as well as the formation of cavities and spherical pure Ag particles. Those particles produced under optimal conditions experienced only a slight weight increase of 0.4% after 75 min exposure to air at 150 C, suggesting that they have an excellent resistance to oxidation at this temperature.

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“…To remove larger nanoparticles, a filtration of CMP slurries is usually conducted. Nevertheless, even after filtering of the slurries, defects are often observed on the polished surfaces and may be higher than expected [44]. As a result, there is a suspicion that some of the defects may be created by the agglomeration of nanoparticles formed during the CMP process.…”

Section: Stabilization Of Cmp Slurriesmentioning

confidence: 94%

“…The selective layer copper in CuO and Cu 2 O have BE values of about 933.4 eV and 934.5 eV, respectively [35,44]. CuO signals can be identified clearly for the sample of pH 8.…”

Section: Effect Of the Slurry Nanoparticle Size And Concentrationmentioning

confidence: 99%

Chemical-Mechanical Impact of Nanoparticles and pH Effect of the Slurry on the CMP of the Selective Layer Surfaces

Ilie

Ipate

2017

Lubricants

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This paper provides a tribochemical study of the selective layer surface by chemical mechanical planarization (CMP). CMP is used to remove excess material obtained in the process of selective transfer. The paper aims at a better understanding of the planarization (polishing) and micromachining. The planarization becomes effective if the material removal rate (MRR) is optimal and the surface defects are minimal. The pH of the slurry plays a very important role in removing the selective layer by CMP, and hydrogen peroxide (H 2 O 2 ) is the most common oxidizer used in CMP slurry. The purpose of this paper is the analysis of the pH effect on the etching rate (ER) and on the behavior of selective layer polishing by a constant concentration of H 2 O 2 and the influence of nanoparticles size and concentration on selective layer surface CMP. The nanoparticle size used is 250 nm. The MRR results through CMP and ER have been shown to be influenced by the presence of oxides on the selective layer surface and have been found to vary with the slurry pH at constant H 2 O 2 concentrations. The CMP slurry plays an important role in the CMP process performance and should be monitored for optimum results and minimal surface defects. The paper analyzes the impact of chemical-mechanical, inter-nanoparticle, and pad-nanoparticle-substrate interactions on CMP performance, taking into account the state of friction at the interface, by measuring the friction force. Selective layer CMP optimization studies were required to control the chemical and mechanical interactions at the interface between the slurry and the selective layer, the slurry chemistry, the properties, and the stability of the suspended abrasive nanoparticles.

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Chemical information from XPS—applications to the analysis of electrode surfaces

Cited by 355 publications

References 0 publications

Cu–Sn Bimetallic Catalyst for Selective Aqueous Electroreduction of CO₂ to CO

Cu–Sn Bimetallic Catalyst for Selective Aqueous Electroreduction of CO₂ to CO

Resistance to Oxidation at 150℃ of Sub-Micrometer Diameter Silver-Coated Copper Particles Produced by Wet Chemical Synthesis and Immersion Plating

Chemical-Mechanical Impact of Nanoparticles and pH Effect of the Slurry on the CMP of the Selective Layer Surfaces

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Chemical information from XPS—applications to the analysis of electrode surfaces

Cited by 355 publications

References 0 publications

Cu–Sn Bimetallic Catalyst for Selective Aqueous Electroreduction of CO2 to CO

Cu–Sn Bimetallic Catalyst for Selective Aqueous Electroreduction of CO2 to CO

Resistance to Oxidation at 150℃ of Sub-Micrometer Diameter Silver-Coated Copper Particles Produced by Wet Chemical Synthesis and Immersion Plating

Chemical-Mechanical Impact of Nanoparticles and pH Effect of the Slurry on the CMP of the Selective Layer Surfaces

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Cu–Sn Bimetallic Catalyst for Selective Aqueous Electroreduction of CO₂ to CO

Cu–Sn Bimetallic Catalyst for Selective Aqueous Electroreduction of CO₂ to CO