Chemical mechanical polishing of polycarbonate and poly methyl methacrylate substrates

Zhong, Zhao; Wang, Z. F.; Zirajutheen, B. M. P.

doi:10.1016/j.mee.2005.04.005

Cited by 23 publications

(6 citation statements)

References 35 publications

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“…The average MRR for the optical silicon substrates polished at a polish pressure of 9,800 Pa was 88% higher (better) than that polished at 4,900 Pa. This makes sense as MRRs increase with increased polish pressures [37]. However, the average MRR for the optical silicon substrates polished at a pad rotational speed of 20 rpm was 171% higher than that polished at 40 rpm.…”

Section: Mrrmentioning

confidence: 96%

Optimization of the chemical mechanical polishing process for optical silicon substrates

Zhong

Tian

Ang

et al. 2011

Int J Adv Manuf Technol

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Chemical mechanical polishing (CMP) experiments are performed to study the effects of four key process factors on the flatness and surface finish of the polished optical silicon substrates and on the material removal rate (MRR). The experimental results and analyses reveal that the pad rotational speed and polish pressure have significant effects on the MRR, the interaction of the polish head rotational speed and slurry supply velocity and the interaction of the polish pressure and polish head rotational speed have significant effects on the flatness, and the pad rotational speed has a significant effect on the surface roughness R t of the optical silicon substrates polished. The optimal combination of the four factors investigated is a polish pressure of 9,800 Pa, a pad rotational speed of 20 rpm, a polish head rotational speed of 20 rpm, and a slurry supply velocity of 100 ml/min. A confirmation CMP experiment has been carried out using the optimal process parameter setting obtained from the design of experiments analyses. The goal to attain optical silicon substrates with nanometric surface roughness and micrometric flatness by an optimized CMP process with a high MRR simultaneously so as to reduce the polishing time to only 15 min from over 8 h has been achieved.

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Section: Mrrmentioning

confidence: 96%

Optimization of the chemical mechanical polishing process for optical silicon substrates

Zhong

Tian

Ang

et al. 2011

Int J Adv Manuf Technol

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“…[12]. In CMP of poly-methyl methacryate (PMMA) and polycarbonate (PC), it was found that for a higher material removal rate (MRR), the table speed and head load should increase, while for lower surface roughness, they should be decreased [13,14]. From the CMP of silicon, it was found the MRR increased rapidly when the table speed increased, because the mechanical abrasion is faster and the frictional heat generated at the interface enhanced the chemical reactions [15].…”

Section: Please Scroll Down For Articlementioning

confidence: 99%

Chemical Mechanical Polishing (CMP) Processes for Manufacturing Optical Silicon Substrates with Shortened Polishing Time

Zhong

Tian

et al. 2014

Materials and Manufacturing Processes

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Silicon substrates are used in optical components for infrared systems and mirror systems. An alternative to processing of optical silicon substrates is chemical mechanical polishing (CMP). The conventional CMP uses a three-body abrasion. In this work, a two-body abrasion CMP, called the fixed abrasive CMP, is performed on silicon substrates. Experiments are performed and results show that the material removal rate (MRR) is largely dependent on head load. Similarly, an increase in table speed would give the same effect. Compared to the conventional CMP, MRRs for the fixed abrasive CMP process are much higher. This high processing efficiency would drastically reduce the time for polishing of silicon substrates. It has been confirmed that the total polishing time can be shortened to a few minutes from hours.

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“…Poly(methyl methacrylate) (PMMA) has the advantages of high transparency, high mechanical strength, lightweight, easy processing, good dielectric properties, and insulation, and has been widely used in various fields such as architecture, aviation, medicine, and the chemical industry. − It is also used in museum artifact preservation and exhibition, allowing archeologists and other researchers to directly observe artifacts. Due to the characteristics of this organic polymer material, long-term exposure to sunlight and air can result in a certain degree of aging, which manifests as molecular chain degradation and molecular weight reduction at the microscopic level, and a decrease in optical properties such as light transmittance, as well as reduced toughness, tensile strength, and fatigue strength at the macroscopic level .…”

Section: Introductionmentioning

confidence: 99%

Novel Life Prediction Method of PMMA for Cultural Relics Protection Based on the BP Neural Network

Zhang,

Wang,

Peng

et al. 2023

ACS Omega

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Poly(methyl methacrylate) (PMMA) is widely used in the preservation and exhibition of cultural relics in museums. Accurately predicting its service life can help avoid many negative effects caused by PMMA aging. To study the change in the yellowing index of PMMA after aging in a UV light environment, an aging experiment was conducted. A prediction model for the service life of PMMA was established using nonlinear curve fitting and a back propagation (BP) neural network. By comparing the goodness of fit, simulation and modeling capabilities of the initial data, and the predictive ability for new data, it was found that the BP neural network prediction model outperformed the nonlinear curve fitting prediction model. In this study, the service life of newly produced PMMA samples was calculated as 7.83, 8.47, and 8.42 years, based on the yellowing index of retired PMMA as a benchmark and using the output data from the BP neural network prediction model. At this time, the performance and exhibition effect of the PMMA are poor, and the batch of PMMA needs to be updated.

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Chemical mechanical polishing of polycarbonate and poly methyl methacrylate substrates

Cited by 23 publications

References 35 publications

Optimization of the chemical mechanical polishing process for optical silicon substrates

Optimization of the chemical mechanical polishing process for optical silicon substrates

Chemical Mechanical Polishing (CMP) Processes for Manufacturing Optical Silicon Substrates with Shortened Polishing Time

Novel Life Prediction Method of PMMA for Cultural Relics Protection Based on the BP Neural Network

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