Chemical sintering of Ag nanoparticle conductive inks at room temperature for printable electronics

Rezaga, Bethel Faith Y.; Balela, Mary Donnabelle L.

doi:10.1007/s10854-021-06313-7

Cited by 9 publications

(8 citation statements)

References 40 publications

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“…Moreover, UV sintering might not achieve the same level of conductivity as other sintering techniques due to less effective particle coalescence and densification . Vacuum sintering allows the evaporation of insulating organics under vacuum at room or moderately elevated temperatures. , This technique can aid in the densification of particles by accelerating the removal of ink solvent and trapped gas bubbles within conductive structures, which might otherwise inhibit particle connectivity. , In addition, various chemical species, such as hydrochloric acid (HCl), acetic acid (CH 3 COOH), and even water vapor (H 2 O), have shown the capability to sinter metal NPs and improve electrical conductivity. ,− Despite significant efforts by the aforementioned sintering studies, a detailed comparison of their effects in the scope of printed electronics, such as the printing of conductive patterns or circuits, is still lacking. Moreover, their environmental impact, including potential energy costs, remains not fully understood.…”

Section: Introductionmentioning

confidence: 99%

Alternative Sintering Processes and Their Influence on the Electrical Resistance of Printed Ag Nanoparticle Conductive Networks

Podolak,

Arefin,

Moni

et al. 2024

ACS Appl. Electron. Mater.

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The effectiveness of postprinting treatment processes, particularly sintering, is essential in optimizing the functionality of printed electronics. However, evaluating various sintering techniques has largely been qualitative, while a comprehensive analysis of their impacts in the context of flexible electronics is missing. Using Ag-based nanoparticle ink as a case study, this work systematically examines four distinct sintering methods, thermal, vacuum, chemical, and photonic (using nonthermal ultraviolet light), to quantitatively evaluate their performance and feasibility in the large-scale fabrication of printed electronics. In particular, we studied chemical sintering by quantifying the role of chemical agents in the device's conductivity. While this work does not intend to cover all existing sintering methods for printed electronics, our findings offer a detailed evaluation of several postprinting treatment processes, shedding light on how different sintering approaches affect the performance of printed electronic components and architecture.

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Section: Introductionmentioning

confidence: 99%

Alternative Sintering Processes and Their Influence on the Electrical Resistance of Printed Ag Nanoparticle Conductive Networks

Podolak,

Arefin,

Moni

et al. 2024

ACS Appl. Electron. Mater.

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“…However, due to the presence of Ag 2 O nano-particles, the ink had strong photosensitivity, which required avoiding exposure to light during storage; otherwise, the metal particles would aggregate, leading to nozzle blockage. Rezaga and Balela used silver acetate (CH 3 COOAg) and ascorbic acid (C 6 H 8 O 6 ) as silver precursors and reducing agents, respectively. Polyacrylic acid (PAA) and sodium polyacrylate (PAA-Na) were used as stabilizers or end-capping agents to prepare ink, which was mixed with a halide solution and sintered at room temperature, thus possessing the advantage of low-temperature sintering.…”

Section: Introductionmentioning

confidence: 99%

Low-Temperature Self-Stacking Ink for Electrohydrodynamic Direct Writing

Zhong

Kang

et al. 2023

ACS Appl. Polym. Mater.

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Flexible electronics have gained significant attention in various fields due to their widespread applications in production and daily life. The electrohydrodynamic direct writing (EDW) is a promising method for fabricating flexible electronics due to its high efficiency, low cost, and ability to produce high-resolution patterns. However, traditional metal-based inks used in the EDW often suffer from agglomeration and needle blockage, which negatively impacts the direct writing effect, especially on flexible substrates. To address these issues, this study proposes a particle-free ink formulation that is simple to prepare and exhibits excellent performance. Polyethylene oxide is a long-chain polymer, and its aqueous solution is a non-Newtonian fluid, which is often used as a thickener and complexing agent for inks. The ink is prepared using a one-pot method based on the silver-amine complexation mechanism, which enables low-temperature sintering without metal particle agglomeration. The fibers fabricated from the ink exhibit a remarkable sintering performance, achieving a resistance of 3.00 kΩ/cm at low temperature of 50 °C. Additionally, the ink produces fibers with self-stacking properties that can be utilized to control the resistance of the fiber. Overall, this ink formulation has significant potential for the preparation of flexible electronics.

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“…Some reports showed that Ag NPs and nanowires exhibit room temperature sintering properties in the presence of electrolytic halides. 16,17 For example, AgCu core−shell NPs synthesized under organic conditions were sintered at room temperature utilizing a reducing agent like hydrazine. In other methods, the room temperature sintering involved galvanic displacement and subsequent electrolytic conditions.…”

Section: ■ Introductionmentioning

confidence: 99%

“…On the other hand, the process of reverse Ostwald ripening occurs when smaller particles break away from the NCs, which can lead to a bimodal distribution of NCs/NPs . Different methods such as wet chemical and physical methods have been demonstrated for the synthesis, − but most of the methods require organic solvents and high temperature. The NPs synthesized in aqueous solution or low temperatures often suffer from instability due to the propensity of aggregations.…”

Section: Introductionmentioning

confidence: 99%

“…There have been limited reports on the ability of near-room temperature sintering for silver-based nanoinks or nanopastes. Some reports showed that Ag NPs and nanowires exhibit room temperature sintering properties in the presence of electrolytic halides. , For example, AgCu core–shell NPs synthesized under organic conditions were sintered at room temperature utilizing a reducing agent like hydrazine. In other methods, the room temperature sintering involved galvanic displacement and subsequent electrolytic conditions. , We report herein a new approach to scalable synthesis of silver–copper (AgCu) alloy NPs and nanoinks with room temperature sintering capability.…”

Section: Introductionmentioning

confidence: 99%

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Silver–Copper Alloy Nanoinks for Ambient Temperature Sintering

et al. 2022

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There is an increasing need to reduce the silver content in silver-based inks or pastes and achieve low-temperature sintering for scalable and low-cost production of printed wearable electronics. This need depends on the ability to control the metal composition and the surface properties of the nanoinks. Alloying silver with copper provides a pathway for meeting the need in terms of cost reduction, but little is known about the composition controllability and the low-temperature sintering capability. We report herein a scalable wet chemical synthesis of bimetallic silver–copper alloy nanoinks with room temperature sintering properties. The bimetallic alloy nanoparticles with a controllable composition can be formulated as stable nanoinks. The nanoinks printed on paper substrates are shown to sinter under room temperature. In addition to composition dependence, the results reveal an intriguing dependence of sintering on humidity above the printed nanoink films. These findings are assessed based on theoretical simulation of the sintering processes via surface-mediated sintering and interparticle necking mechanisms in terms of nanoscale adsorption, adhesion and diffusion, and surface free energies. Implications of the findings for room temperature fabrication of wearable sensors are also discussed.

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Chemical sintering of Ag nanoparticle conductive inks at room temperature for printable electronics

Cited by 9 publications

References 40 publications

Alternative Sintering Processes and Their Influence on the Electrical Resistance of Printed Ag Nanoparticle Conductive Networks

Alternative Sintering Processes and Their Influence on the Electrical Resistance of Printed Ag Nanoparticle Conductive Networks

Low-Temperature Self-Stacking Ink for Electrohydrodynamic Direct Writing

Silver–Copper Alloy Nanoinks for Ambient Temperature Sintering

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