2022
DOI: 10.1039/d1ra06933k
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Chemical vapor deposition merges MoS2 grains into high-quality and centimeter-scale films on Si/SiO2

Abstract: Control of the precursor transport through oxygen dosing yields increased MoS2 coverage and increased connectivity between crystalline MoS2 domains.

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Cited by 4 publications
(3 citation statements)
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“…The SEDP process permits the self‐alignment of contacts by utilizing the mandrel as the source electrode, the spacer as a dielectric, and a subsequently deposited metal layer as the drain electrode (inset Figure 4e) (more details on the fabrication can be found in the Supporting Information; Figure S2, Supporting Information). The thus‐produced edge‐contacted nanosheet transistor demonstrates semiconducting behavior with a field‐effect mobility of 0.52cm 2 V −1 s −1 , which is comparable to the pristine channel material [ 43 ] and emphasizes the suitability of our approach to create ultra‐scaled devices without introducing additional process‐related defects and impurities. Moreover, the unexpected transconductance characteristic compared to conventional SiO 2 ‐supported FET devices agrees with previous findings about the beneficial effect of the Al 2 O 3 spacer on avoiding Fermi‐level pinning and recovering the intrinsic ambipolar nature of MoS 2 .…”
Section: Resultsmentioning
confidence: 99%
“…The SEDP process permits the self‐alignment of contacts by utilizing the mandrel as the source electrode, the spacer as a dielectric, and a subsequently deposited metal layer as the drain electrode (inset Figure 4e) (more details on the fabrication can be found in the Supporting Information; Figure S2, Supporting Information). The thus‐produced edge‐contacted nanosheet transistor demonstrates semiconducting behavior with a field‐effect mobility of 0.52cm 2 V −1 s −1 , which is comparable to the pristine channel material [ 43 ] and emphasizes the suitability of our approach to create ultra‐scaled devices without introducing additional process‐related defects and impurities. Moreover, the unexpected transconductance characteristic compared to conventional SiO 2 ‐supported FET devices agrees with previous findings about the beneficial effect of the Al 2 O 3 spacer on avoiding Fermi‐level pinning and recovering the intrinsic ambipolar nature of MoS 2 .…”
Section: Resultsmentioning
confidence: 99%
“…For MoS 2 , the minimum σ is 8.28 S m −1 at 403 K and achieved a maximum σ of 1692 S m −1 at 691 K. For pure rGO, the S 2 σ is very low compared to the hybrid MoS 2 /rGO and shown in supplementary where k B is Boltzman constant (eV/K), s 0 constant and T is temperature (K). E a is 0.51 eV in the region of (25)(26)(27)(28)(29)(30)(31)(32)(33)(34)(35)(36)(37)(38) eV K −1 and E a is low in the region of (23-20) eV K −1 of 0.44 eV for MoS 2 . For MoS 2 /rGO, E a is −0.34 eV at eV region, a positive value of E a represents more energy required to move the carriers, thus decreased σ.…”
Section: Conductivity ( ( ))mentioning
confidence: 98%
“…Chemical vapor deposition (CVD), as a bottom-up synthesis method, uses precursors that are heated to high temperatures and then driven by a gas stream to react with the active substrate [44,45]. Especially for synthesizing porous carbon materials with desirable mechanical properties and electrical conductivity, CVD technology can create electrodes with unique properties of three-dimensional structure [46][47][48].…”
Section: Preparation Of Three-dimensional Electrodementioning
confidence: 99%