1999
DOI: 10.1021/cm981047a
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Chemical Vapor Deposition of Tantalum Oxide from Tetraethoxo(β-diketonato)tantalum(V) Complexes

Abstract: The complexes [Ta(OEt) 4 (β-diketonate)] (β-diketonate ) acetylacetonate, 2; hexafluoroacetylacetonate , 3; 1,1,1-trifluoroacetylacetonate, 4; dipivaloylmethanate, 5; 2,2-dimethyl-6,6,7,7,8,8,8-heptafluoro-3,5-octanedionate, 6) are established as volatile liquid precursors for low-pressure chemical vapor deposition (CVD) of films of tantalum(V) oxide. They give thermal CVD at a slightly lower temperature than the commonly used precursor [{Ta-(OEt) 5 } 2 ], 1. In all cases, the CVD at 300-450 °C gives amorphous… Show more

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Cited by 56 publications
(35 citation statements)
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“…[8] These carbon levels also compare very favorably with those of 2±10 at.-% detected in Ta 2 O 5 films deposited by MOCVD from Ta(OEt) 4 (b-diketonate)/O 2 . [21,22] In the absence of oxygen, complex 1 is therefore effectively acting as a ªsingle sourceº precursor, and this is consistent with previous studies in which MgO …”
Section: Growth Of Mgo Thin Filmssupporting
confidence: 91%
“…[8] These carbon levels also compare very favorably with those of 2±10 at.-% detected in Ta 2 O 5 films deposited by MOCVD from Ta(OEt) 4 (b-diketonate)/O 2 . [21,22] In the absence of oxygen, complex 1 is therefore effectively acting as a ªsingle sourceº precursor, and this is consistent with previous studies in which MgO …”
Section: Growth Of Mgo Thin Filmssupporting
confidence: 91%
“…4 ], which gives kinetic-controlled HfO 2 growth in the temperature range 300±400 C, and diffusion-controlled growth at 400±500 C. [19] Although 4 ], [14] and variable O:M ratios are a common feature in metal±oxide films deposited by MOCVD from a variety of precursors. [6,23±25] Stoichiometric metal±oxide films can be readily obtained by a postgrowth anneal in air or oxygen at 600±1000 C. [6,25] Relatively high levels (9.5±10.8 at. [17] and it was noted that the carbon levels could be decreased by increasing the injected oxygen gas flow rate.…”
Section: Introductionmentioning
confidence: 99%
“…[43] Non-stoichiometric oxide films are frequently produced by MOCVD processes involving metal alkoxide precursors, [42,44] and stoichiometric oxide films can readily be obtained by a post-growth anneal in air or oxygen at 600 À 1000 8C. [45] The TiO x films deposited from (1) and [(MeCp)-Ti(NMe 2 ) 3 ] show a high level of carbon contamination (C ¼ 12.7 at.-%). Significantly, carbon was reportedly absent in TiO 2 films grown by MOCVD using [Ti(NMe 2 ) 4 ], [29] suggesting that the major route to carbon incorporation is the decomposition of the [2,5-dimethylpyrrolyl] 3 (dmae)] (C ¼ 2.9 À 7.7 at.-%), [31] …”
Section: Mocvd Of Tio 2 Thin Filmsmentioning
confidence: 99%