CHF correlation of boiling in FC-72 with micro-pin-fins for electronics cooling

Zhang, Yonghai; Zhou, Jie; Zhou, Wenjing; Qi, Baojin; Wei, Jinjia

doi:10.1016/j.applthermaleng.2018.04.053

Cited by 44 publications

(16 citation statements)

References 31 publications

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“…For this study, the diameter of the pin fin changes from 2 to 4 mm, and results indicated that pin‐fin heat sink with 3 mm fin diameter showed the best thermal performance. Zhang et al 23 established the critical heat flux (CHF) correlation of boiling in FC‐72 with micropin fins for electronics cooling. It was observed that fin configuration and pitch have significant impacts on CHF and the boiling heat transfer coefficient.…”

Section: Experimental Studiesmentioning

confidence: 99%

Improvement of heat transfer through fins: A brief review of recent developments

Maji¹,

Choubey

2020

Heat Trans

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Fins or extended surfaces are generally used in heat exchangers to enhance heat transfer between the main surface and ambient fluid. Various types of simple-shaped fins, namely, rectangular, square, annular, cylindrical, and tapered, have been used with different geometrical combinations. To satisfy industrial demand, different trials have also been carried out for designing optimized fins. The optimization of fins can be performed either by enhancing heat dissipation at an exact fin weight or by diminishing the weight of the fin by precise heat dissipation. Recently a notable amount of work on some typical fins, like, porous fins and perforated fins, has also been carried out. This paper presents a brief review on heat transfer enhancement using fins of different types considering variable thermophysical and geometric parameters, which will also be useful for future use of geometrical modifications of extended surfaces, based on the cost and availability of space.analytical approach, computational approach, experimental approach, perforated fin, porous fin | INTRODUCTIONAdvanced technologies need high-performance heat transfer equipment. Techniques for enhancing the heat transfer rate are classified into two categories: active and passive methods. In the design point of view, active methods are complex as they require some extraneous power input for necessary flow adjustments and to improve the heat transfer rate and thus applications are limited. On the other hand, passive methods require geometrical or surface adjustments to the flow passage by incorporating additional devices. Additionally, by interrupting or varying the existing flow behavior (except for extended surfaces); higher heat transfer coefficients are promoted through this method, which is also followed by an increase in the corresponding pressure drop. The amount of conduction, convection, and radiation of an object shows the amount of heat it transfers. The heat transfer rate is enhanced by increasing the temperature difference between the object and the environment or by enhancing the coefficient of convective heat transfer or by maximizing the surface area of the body. In some cases, it is not appropriate or cost effective to alter the first two options. Introducing a fin to a body, however, expands the surface area and sometimes this is a cost-effective solution for heat transfer problems. Extended surfaces or fins are illustrations of passive methods that are generally used in different industrial applications for the enhancement of heat transfer between the primary surface (heat sink) and the surrounding fluid. Currently reducing the cost and size of fins is the key target of the fin industry. This demand is generally met by the high-thermal-conductivity and costly metals used to fabricate finned surfaces. Many efforts have been made to construct optimized fins. (a) By changing the size and shape of the solid fin: Instead of a longitudinal rectangular solid fin, if the geometry of fin design is changed, the performance parameters and heat tr...

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Section: Experimental Studiesmentioning

confidence: 99%

Improvement of heat transfer through fins: A brief review of recent developments

Maji¹,

Choubey

2020

Heat Trans

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“…is a dimensionless number similar to the dimensionless number proposed by Zhang et al [29], which represents both capillary wicking and flow resistance.…”

Section: Tfec-2020-32028mentioning

confidence: 99%

A Predictive Model for Boiling Heat Transfer Coefficient of Dielectric Fluids on Metal Foams

Manetti

Moita

Cardoso

2020

Proceeding of 5th Thermal and Fluids Engineering Conference (TFEC)

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Pool boiling is a suitable technique for direct immersion cooling in electronic devices coupled with dielectric fluids. However, these fluids have relatively poor thermophysical properties in contrast to water, and extremely small contact angle that causes temperature overshooting at the boiling incipience. So, the use of surface enhancement techniques such as porous surfaces has been widely reported to enhance heat transfer performance and meet the cooling requirements. The porous thickness and pore size are the most important parameters of a porous surface, and their optimal values mainly depend on the fluid properties. This work aims to investigate the performance of metal foams of nickel and copper, with different pore diameter and thicknesses on pool boiling, using HFE-7100 as working fluid. A predictive model was proposed for the heat transfer coefficient (HTC) based on the Buckingham π theorem and experimental database. Additional data were taken from the literature for comparative purposes. The dimensionless numbers showed a greater contribution of the transient heat conduction and single-phase convection than the latent heat. In addition, as the pore diameter decreases the HTC increases. The thickness presents a variable exponent, which is a function of the heat flux, due to the balance of heat transfer area and vapor bubble resistance. The developed model accurately predicts 93% of the experimental data within an error band of ± 30% and absolute mean deviation of 13%; moreover, the developed model predicts 68% (within the ± 30% error band) of data from the literature for different working fluids and foams parameters.

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“…Researchers have studied how CHF and HTC can be increased by fabricating porous coatings on a plain surface [1,3,4,5,6,7,8,9,10], nano-structures on a plain surface [11,12], laser-processed structures [4,13], rough surfaces [14,15], enhanced designed surfaces [16], micro-patterned structures [6,15,17,18,19,20], or combined structures with micro-patterned structures and porous coating [6,21,22]. Their results indicate significant improvements in both the CHF and HTC.…”

Section: Introductionmentioning

confidence: 99%

“…Their results indicate significant improvements in both the CHF and HTC. Common fabrication methods for the micro-pattern or micro-channel are electric discharge machining [6,17] or computer numerical control (CNC) machining [21,22] for metallic surfaces and dry etching [15,18,19,20] for silicon surfaces.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of Micro-Patterned Surface for Pool-boiling Enhancement by Using Powder Injection Molding Process

et al. 2019

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In this study, two kinds of copper micro-patterned surfaces with different heights were fabricated by using a powder injection molding (PIM) process. The micro-pattern’s size was 100 μm, and the gap size was 50 μm. The short micro-pattern’s height was 100 μm, and the height of the tall one was 380 μm. A copper powder and wax-polymer-based binder system was used to fabricate the micro-patterned surfaces. The critical heat flux (CHF) and heat transfer coefficient (HTC) during pool-boiling tests were measured with the micro-patterned surfaces and a reference plain copper surface. The CHF of short and tall micro-patterned surfaces were 1434 and 1444 kW/m2, respectively, and the plain copper surface’s CHF was 1191 kW/m2. The HTC of the plain copper surface and the PIM surface with short and tall micro-patterned surfaces were similar in value up to a heat flux 1000 kW/m2. Beyond that value, the plain surface quickly reached its CHF, while the HTC of the short micro-patterned surface achieved higher values than that of the tall micro-patterned surface. At CHF, the maximum values of HTC for the short micro-pattern, tall micro-pattern, and the plain copper surface were 68, 58, and 57 kW/m2 K.

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CHF correlation of boiling in FC-72 with micro-pin-fins for electronics cooling

Cited by 44 publications

References 31 publications

Improvement of heat transfer through fins: A brief review of recent developments

Improvement of heat transfer through fins: A brief review of recent developments

A Predictive Model for Boiling Heat Transfer Coefficient of Dielectric Fluids on Metal Foams

Fabrication of Micro-Patterned Surface for Pool-boiling Enhancement by Using Powder Injection Molding Process

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