2022
DOI: 10.1541/ieejjia.21006215
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Chip Layout Optimization of SiC Power Modules Based on Multiobjective Electro-Thermal Design Strategy

Abstract: Electro-thermal co-design of power modules is required to maximize the capabilities of promising power semiconductor devices. The chip layout on the substrate, which is restricted by the size of the power module substrate, determines the electrical and thermal characteristics of the power module. This paper proposes a chip layout optimization strategy for power modules based on a multiobjective electro-thermal design algorithm. The parasitic inductance and thermal resistance of the SiC power module are evaluat… Show more

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Cited by 8 publications
(2 citation statements)
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“…Equation (2) considers the case of an ideal MOS capacitor where there is no work function difference between the metal and the semiconductor, and all doped impurities are ionized. Equation (2) shows that when the oxide charge Q ox changes due to gate oxide degradation, the depletion layer capacitances C dc and C dj are affected not only by the applied gate-source voltage v GS but also by the oxide charge Q ox . However, the oxide charge Q ox does not interact electrically with the semiconductor.…”
Section: Gate Oxide Degradation and Characteristics Fluctuation A The...mentioning
confidence: 99%
“…Equation (2) considers the case of an ideal MOS capacitor where there is no work function difference between the metal and the semiconductor, and all doped impurities are ionized. Equation (2) shows that when the oxide charge Q ox changes due to gate oxide degradation, the depletion layer capacitances C dc and C dj are affected not only by the applied gate-source voltage v GS but also by the oxide charge Q ox . However, the oxide charge Q ox does not interact electrically with the semiconductor.…”
Section: Gate Oxide Degradation and Characteristics Fluctuation A The...mentioning
confidence: 99%
“…Furthermore, stray inductance and capacitance result in oscillations in the switching waveforms, which are sources of noise [8]. Therefore, the development of bus bar and power module designs to optimize parasitic parameters has been investigated extensively [9], [10], [11], [12], [13]. Reference [14] presents a design procedure for an acceptable stray inductance in a high-speed switching circuit, considering the switching period, voltage, and current rating of the circuit.…”
Section: Introductionmentioning
confidence: 99%