Chlorine-induced restructuring of the Cu/Si(111) surface

Potapenko, Denis V.; Sysoev, S. E.; Ermakov, А. V.; Hinch, B. J.; Strongin, Daniel R.; Wright, Andrew N.; Kuivila, C.

doi:10.1103/physrevb.68.075408

Cited by 5 publications

(6 citation statements)

References 24 publications

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“…Halogens play an important role in many technological processes, like in surface-induced morphology, corrosion, etching and restructuring processes [1][2][3][4]. As they interact strongly with all metal surfaces, they efficiently poison their top layer and thus inhibit various catalytic reactions.…”

Section: Introductionmentioning

confidence: 99%

Chlorine chemisorption on Cu(0 0 1) by surface X-ray diffraction: Geometry and substrate relaxation

et al. 2007

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Section: Introductionmentioning

confidence: 99%

Chlorine chemisorption on Cu(0 0 1) by surface X-ray diffraction: Geometry and substrate relaxation

et al. 2007

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“…[1][2][3][4] Moreover, iron (ferric) chlorides are commonly used in environmental applications: for instance, ferric(III) chloride is commonly used in water treatment as a coagulant to remove organic content. 5 Ferric chlorides are also deployed as a potential leaching agent in chemical beneficiations of many metals.…”

Section: Introductionmentioning

confidence: 99%

Thermodynamic stability and structures of iron chloride surfaces: A first-principles investigation

Saraireh

Altarawneh

2014

The Journal of Chemical Physics

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In this study, we report a comprehensive density functional theory investigation of the structure and thermodynamic stability of FeCl2 and FeCl3 surfaces. Calculated lattice constants and heats of formation for bulk FeCl2 and FeCl3 were found to be in relatively good agreement with experimental measurements. We provide structural parameters for 15 distinct FeCl2 and FeCl3 surfaces along the three low-index orientations. The optimized geometries for all surfaces are compared with analogous bulk values. Ab initio atomistic thermodynamic calculations have been carried out to assess the relative thermodynamic stability of FeCl2 and FeCl3 surfaces under practical operating conditions of temperatures and pressures. The FeCl2 (100-Cl) surface is found to afford the most stable configuration at all experimentally accessible gas phase conditions.

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“…Initially, the interactions of CH 3 and/or Cl monolayers on Si/Cu surfaces were studied. [14][15][16][17][18] The present contribution builds on these prior studies and makes the first UHV controlled investigations of the effects of Sn on the thermal chemistry of CH 3 on Si/Cu(100). In this study, we use a combination of TPD, XPS, ISS, LEED, AES, and HAS to investigate the formation of Sn/Si/Cu(100) structures and to elucidate new methylsilane desorption mechanisms in the presence of surface bound Sn.…”

Section: Introductionmentioning

confidence: 99%

“…A less extensive body of research, using surface science techniques in vacuum environments on polycrystalline and single crystal Si/Cu surfaces (without promoter atoms), has also concentrated on the Direct Synthesis. Initially, the interactions of CH 3 and/or Cl monolayers on Si/Cu surfaces were studied. − The present contribution builds on these prior studies and makes the first UHV controlled investigations of the effects of Sn on the thermal chemistry of CH 3 on Si/Cu(100). In this study, we use a combination of TPD, XPS, ISS, LEED, AES, and HAS to investigate the formation of Sn/Si/Cu(100) structures and to elucidate new methylsilane desorption mechanisms in the presence of surface bound Sn.…”

Section: Introductionmentioning

confidence: 99%

Thermal Chemistry of CH₃ on Si/Cu(100); the Role of Sn as a Promoter

et al. 2004

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The effect of tin on the thermal chemistry of CH 3 on Si/Cu(100) was investigated using temperature programmed desorption (TPD), X-ray photoelectron spectroscopy (XPS), ion scattering spectroscopy (ISS), low energy electron diffraction (LEED), Auger electron spectroscopy (AES), and high-resolution helium atom scattering (HAS). The Si/Cu(100) substrate was prepared by exposure to silane at 420 K. The TPD results showed that (CH 3 ) 3 SiH was the dominant product desorbing from Si/Cu(100) after exposure to CH 3 radical, and that its desorption was sensitive to the concentration of Si in the outermost surface. For the silanesaturated surface, Si sat /Cu(100), (CH 3 ) 3 SiH desorbed near 500 K, while for subsaturated surfaces, Si unsat /Cu(100), (CH 3 ) 3 SiH desorbed at both 270 and 500 K. The addition of Sn to the Si sat /Cu(100) surface, prior to CH 3 exposure, led to a shift in the (CH 3 ) 3 SiH desorption feature to higher temperatures. Tin addition to Si unsat /Cu(100) surface changed the product distribution. Specifically, with Sn coadsorption levels in excess of 0.7 ML, the dominant product is the fully methylated species, (CH 3 ) 4 Si, at 430 K.

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Chlorine-induced restructuring of the Cu/Si(111) surface

Cited by 5 publications

References 24 publications

Chlorine chemisorption on Cu(0 0 1) by surface X-ray diffraction: Geometry and substrate relaxation

Chlorine chemisorption on Cu(0 0 1) by surface X-ray diffraction: Geometry and substrate relaxation

Thermodynamic stability and structures of iron chloride surfaces: A first-principles investigation

Thermal Chemistry of CH₃ on Si/Cu(100); the Role of Sn as a Promoter

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Chlorine-induced restructuring of the Cu/Si(111) surface

Cited by 5 publications

References 24 publications

Chlorine chemisorption on Cu(0 0 1) by surface X-ray diffraction: Geometry and substrate relaxation

Chlorine chemisorption on Cu(0 0 1) by surface X-ray diffraction: Geometry and substrate relaxation

Thermodynamic stability and structures of iron chloride surfaces: A first-principles investigation

Thermal Chemistry of CH3 on Si/Cu(100); the Role of Sn as a Promoter

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Thermal Chemistry of CH₃ on Si/Cu(100); the Role of Sn as a Promoter