2008
DOI: 10.1109/ted.2008.922855
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Circuit Modeling and Performance Analysis of Multi-Walled Carbon Nanotube Interconnects

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Cited by 338 publications
(278 citation statements)
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“…This is because that there are more atoms in a larger tube, and the hopping is made easier. 29 I c (µA) can be derived as…”
Section: -6mentioning
confidence: 99%
“…This is because that there are more atoms in a larger tube, and the hopping is made easier. 29 I c (µA) can be derived as…”
Section: -6mentioning
confidence: 99%
“…(1) as constant and evaluating the integral, an I-V expression without integral calculation for nano conductors is derived as shown in Eq. (4). In this equation, DOS represents the density of states value and the term shown as T r is the transmission of electrons.…”
Section: Presented I-v Expression For Ballistic Nano Conductorsmentioning
confidence: 99%
“…Several models for new generation nano conductors exist in the literature [3,4,5] since these models are obviously needed for their design and analysis. In all of these models, current-voltage (I-V ) variations of nano conductors are clearly the main characteristics that have to be modelled accurately [6,7].…”
Section: Introductionmentioning
confidence: 99%
“…where n H and n W are the tube numbers in the vertical and horizontal directions [4], respectively; "Inter [ ]" indicates that only the integer part is taken into account; D and ∆(= 0.34 nm [1,4]) denote the diameter of each metallic tube and the separation between two neighbouring tubes in the bundle, respectively. In Fig.…”
Section: Transfer Function and Absolute Stabilitymentioning
confidence: 99%
“…Significant research progresses have been achieved in modeling single-, double-, and multi-walled CNT (SWCNT, DWCNT and MWCNT) interconnects. These progresses mainly include: (a) the development of RF circuit models for single and bundle interconnects consisting of SWCNT, DWCNT and MWCNT [2][3][4][5]; (b) the extraction of their distributed parameters [6][7][8]; (c) the characterization of crosstalk effects [9,10], (d) the prediction of their performance parameters in comparison with copper interconnects used for advanced CMOS fabrication technologies [11][12][13], and (e) the study on their relative stability [14], power handling capability, and other reliability issues [15]. On the other hand, it must be emphasized that design and fabrication technologies of CNT-based interconnects are very important for their real application in the future 3-D ICs, and some significant progresses can be found in [15][16][17][18][19].…”
Section: Introductionmentioning
confidence: 99%