2003
DOI: 10.1016/s0924-4247(03)00161-4
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Circumferentially oriented Ni cylindrical thin films for torque sensor applications

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Cited by 15 publications
(11 citation statements)
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“…To produce this kind of materials, a variety of technological methods have been developed. These methods include electro-deposition [1], chemical deposition [2], molecular beam epitaxy [3], solidification process [4,5] and so on. However, many traditional techniques are relatively expensive or complicated.…”
Section: Introductionmentioning
confidence: 99%
“…To produce this kind of materials, a variety of technological methods have been developed. These methods include electro-deposition [1], chemical deposition [2], molecular beam epitaxy [3], solidification process [4,5] and so on. However, many traditional techniques are relatively expensive or complicated.…”
Section: Introductionmentioning
confidence: 99%
“…The material of choice in our study is NiFe because of the excellent magnetostrictive properties of Ni [8] and the considerable magnetic moment of Fe. Also NiFe can be easily electrodeposited which is the selected method for the growing of a thin film on the shaft [9][10].…”
Section: The Proposed Sensormentioning
confidence: 99%
“…Conventional electrodeposition devices typically result in non uniformities and microcracks on the surface of the thin film due to tensions built in during the electrodeposistion process [8][9]. In order to attain better control on the sample preparation process, the following parameters must be controlled: the current density, the bath's temperature for higher solubility and the velocity of revolution of the bath for higher uniformity in the NiFe deposition.…”
Section: Sample Preparationmentioning
confidence: 99%
“…2c shows that nickel and copper are the elements deposited on this layer. The thin layer of Ni-Cu alloy whose thickness is less than 1 micrometer produced by direct current plating from a sulphate type bath (using an aqueous citrate electrolyte containing Ni and Cu sulphates) and the alloy composition was varied by changing the deposition current density [11][12][13][14][15]. The followings are the cathodic reactions for nickel-copper electrodeposition:…”
Section: Identification Of the Catalytic Activation Techniquementioning
confidence: 99%