“…For example, at the IC placing stage, defect cases of missing, wrong or doubled components may occur. In terms of possible soldering defects, most of them happen after the reflowing stage, such as the defects at the IC package components (pseudo joint, excess solder, insufficient solder, shifting Solder and bridge defects) and the defects at the non-IC components (side termination, [63] Ring, scratch, zone and repeating types [64] Ring, scratch, random and new patterns [65] Systematic and random patterns [66] Circle, cluster, scratch and spots [67] [68] Bull's Eye, Edge ring, scratch, random, multiple zones, multiple scratches, ring-zone mixed pattern and ring-scratch mixed pattern [69] [70] Multiple zones, multiple scratches, ring-zone mixed pattern and ring-scratch mixed pattern [71] [72] Cluster defects such as scratch, strains and localized failures [58] Checkerboard, ring, right-down edge, composite and random patterns [73] Spatially homogeneous Bernoulli process, cluster, circle, spot, repetitive and mixed pattern [74] Scratch, center and edge [75] Quarter ring, up and left, Quarter ring, up and right, Edge effects, Ring effects, Semi-ring, up, Semi-ring, up Edge effects, up and bottom Cluster [76] Annulus, half-annulus, band and half-ring [77]- [81] Curvilinear, amorphous, and ring [82] Linear and circular patterns [83] [84] Bull's eye, Bottom, Crescent moon, edge and random [85] Random, ring, curvilinear and ellipsoid [59] Line, edge, ring, blob and bull's eye [61] [53] Bull's eye, blob, line, edge, hat and ring [86] Multiple patterns including ring, checkerboard and five radial zones [87] Random, systematic and ,mixed patterns [88] [57] Circle, cluster, repetitive and spot [56], [60], [62], [89]-…”