2008
DOI: 10.1109/tsm.2008.2000269
|View full text |Cite
|
Sign up to set email alerts
|

Classification of Defect Clusters on Semiconductor Wafers Via the Hough Transformation

Abstract: The Hough transformation employing a normal line-to-point parameterization is widely applied in digital image processing for feature detection. In this paper, we demonstrate how this same transformation can be adapted to classify defect signatures on semiconductor wafers as an aid to visual defect metrology. Given a rectilinear grid of die centers on a wafer, we demonstrate an efficient and effective procedure for classifying defect clusters composed of lines at angles of 0 , 45 , 90 , and 135 from the horizon… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
8
0

Year Published

2012
2012
2024
2024

Publication Types

Select...
4
3
1

Relationship

0
8

Authors

Journals

citations
Cited by 29 publications
(8 citation statements)
references
References 15 publications
0
8
0
Order By: Relevance
“…For example, at the IC placing stage, defect cases of missing, wrong or doubled components may occur. In terms of possible soldering defects, most of them happen after the reflowing stage, such as the defects at the IC package components (pseudo joint, excess solder, insufficient solder, shifting Solder and bridge defects) and the defects at the non-IC components (side termination, [63] Ring, scratch, zone and repeating types [64] Ring, scratch, random and new patterns [65] Systematic and random patterns [66] Circle, cluster, scratch and spots [67] [68] Bull's Eye, Edge ring, scratch, random, multiple zones, multiple scratches, ring-zone mixed pattern and ring-scratch mixed pattern [69] [70] Multiple zones, multiple scratches, ring-zone mixed pattern and ring-scratch mixed pattern [71] [72] Cluster defects such as scratch, strains and localized failures [58] Checkerboard, ring, right-down edge, composite and random patterns [73] Spatially homogeneous Bernoulli process, cluster, circle, spot, repetitive and mixed pattern [74] Scratch, center and edge [75] Quarter ring, up and left, Quarter ring, up and right, Edge effects, Ring effects, Semi-ring, up, Semi-ring, up Edge effects, up and bottom Cluster [76] Annulus, half-annulus, band and half-ring [77]- [81] Curvilinear, amorphous, and ring [82] Linear and circular patterns [83] [84] Bull's eye, Bottom, Crescent moon, edge and random [85] Random, ring, curvilinear and ellipsoid [59] Line, edge, ring, blob and bull's eye [61] [53] Bull's eye, blob, line, edge, hat and ring [86] Multiple patterns including ring, checkerboard and five radial zones [87] Random, systematic and ,mixed patterns [88] [57] Circle, cluster, repetitive and spot [56], [60], [62], [89]-…”
Section: Pcb Defectsmentioning
confidence: 99%
See 2 more Smart Citations
“…For example, at the IC placing stage, defect cases of missing, wrong or doubled components may occur. In terms of possible soldering defects, most of them happen after the reflowing stage, such as the defects at the IC package components (pseudo joint, excess solder, insufficient solder, shifting Solder and bridge defects) and the defects at the non-IC components (side termination, [63] Ring, scratch, zone and repeating types [64] Ring, scratch, random and new patterns [65] Systematic and random patterns [66] Circle, cluster, scratch and spots [67] [68] Bull's Eye, Edge ring, scratch, random, multiple zones, multiple scratches, ring-zone mixed pattern and ring-scratch mixed pattern [69] [70] Multiple zones, multiple scratches, ring-zone mixed pattern and ring-scratch mixed pattern [71] [72] Cluster defects such as scratch, strains and localized failures [58] Checkerboard, ring, right-down edge, composite and random patterns [73] Spatially homogeneous Bernoulli process, cluster, circle, spot, repetitive and mixed pattern [74] Scratch, center and edge [75] Quarter ring, up and left, Quarter ring, up and right, Edge effects, Ring effects, Semi-ring, up, Semi-ring, up Edge effects, up and bottom Cluster [76] Annulus, half-annulus, band and half-ring [77]- [81] Curvilinear, amorphous, and ring [82] Linear and circular patterns [83] [84] Bull's eye, Bottom, Crescent moon, edge and random [85] Random, ring, curvilinear and ellipsoid [59] Line, edge, ring, blob and bull's eye [61] [53] Bull's eye, blob, line, edge, hat and ring [86] Multiple patterns including ring, checkerboard and five radial zones [87] Random, systematic and ,mixed patterns [88] [57] Circle, cluster, repetitive and spot [56], [60], [62], [89]-…”
Section: Pcb Defectsmentioning
confidence: 99%
“…As long as a parameterized model can be established for the spatial pattern, this method can be adopted [59]. White et al in [74] used Hough transform based on linear parameterization to detect defective dies patters on WBM. The patters detected in this study were of linear shapes such as scratches and edge patterns.…”
Section: D: Hough Transformmentioning
confidence: 99%
See 1 more Smart Citation
“…3) Linear Attribute: The Hough transform [19], which was applied in [23], was used in the current study to detect the lines in each wafer map. The Hough transform algorithm is detailed as follows.…”
Section: B Geometry-based Featuresmentioning
confidence: 99%
“…Hough transformation [6,7] processing, which is widely used in image processing and the domain of computer vision, such as line detection [8,9].…”
Section: Hough Transformationmentioning
confidence: 99%