Cleaner technologies to minimise the environmental footprint of the footwear bonding process

Abstract

Advances in cleaner technologies have a critical role in reaching Europe’s climate and environmental goals. More precisely, in the case of the footwear bonding process its environmental impact is mainly related to the VOCs emissions resulting from the use of organic solvents in the most common adhesives used, as well as during the application of some surface treatments such as halogenation. Moreover, the use of raw materials of fossil origin also contributes to its carbon footprint. The aim of this work is to deploy cleaner technologies to minimise the environmental footprint of the footwear bonding process through several approaches at different steps of the process life cycle, also to contribute to footwear circularity. This work focuses on the synthesis and application of reactive hot melt polyurethanes from CO2-based polyols as biobased adhesives, and the study of plasma-based surface treatments (low-pressure plasma and atmospheric pressure plasma) to improve adhesion properties, using styrene-butadiene vulcanised (SBR) rubber as a representative footwear soling material. The influence of CO2-based polyols on the polyurethane structure and the physicochemical effects of the plasma treatments on the rubber surface, as well as the final adhesion properties have been evaluated by means of different experimental techniques. The results showed that the values obtained for the T-peel strength of the adhesive joints studied, with the combination of the application of the plasma surface treatments and the biobased reactive hotmelt, exceed the minimum quality requirements for footwear according to the standardised tests. As a result, the deployment of such cleaner technologies regarding adhesives and surface treatments in the footwear bonding process will contribute to improving footwear carbon footprint and its circularity.

Polyurethane Adhesives with Chemically Debondable Properties via Diels–Alder Bonds

“…Thermogravimetric analysis (TGA) was employed to study the thermal stability of polyurethane hot-melt adhesives with a TGA 2 STAR e System thermal balance, equipped with STAR e software 16.30 (Mettler-Toledo AG, Schwerzenbach, Switzerland). The sample was heated from 30 °C to 600 °C in 10 °C/min in an inert nitrogen atmosphere (flow rate = 30 mL min −1 ) [ 38 ].…”