CLICTD: A monolithic HR-CMOS sensor chip for the CLIC silicon tracker

A novel monolithic pixelated sensor and readout chip, the CLIC Tracker Detector (CLICTD) chip, is presented. The CLICTD chip was designed targeting the requirements of the silicon tracker development for the experiment at the Compact Linear Collider (CLIC), and has been fabricated in a modified 180 nm CMOS imaging process with charge collection on a high-resistivity p-type epitaxial layer. The chip features a matrix of 16×128 elongated channels, each measuring 300×30 µm 2. Each channel contains 8 equidistant collection electrodes and analog readout circuits to ensure prompt signal formation. A simultaneous 8-bit Time-of-Arrival (with 10 ns time bins) and 5-bit Time-over-Threshold measurement is performed on the combined digital output of the 8 sub-pixels in every channel. The chip has been fabricated in two process variants and characterised in laboratory measurements using electrical test pulses and radiation sources. Results show a minimum threshold between 135 and 180 e − and a noise of about 14 e − RMS. The design aspects and characterisation results of the CLICTD chip are presented.

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“…Challenges of this approach include the routing of the signals to the chip periphery and will depend on the technology chosen and the feature size of it. Some of these concepts have already been incorporated in ASICs such as the MALTA/Monopix chip [25] implemented in a modified Tower Jazz 180 nm process, and optimised for radiation hardness and speed [26], and were also included in the CLICTD sensor chip [27], optimised for extended efficiency for ultra-thin silicon trackers.…”

Section: Monolithic Cmos Mapsmentioning

confidence: 99%

Tracking and vertex detectors at FCC-ee

Bacchetta

¹

,

Collins

²

,

Riedler

³

2022

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The combined vertexing and tracking performance of the innermost part of the FCC-ee experiments must deliver outstanding precision for measurement of the track momentum together with an impact parameter resolution exceeding by at least a factor five that typically achieved at LHC experiments. Furthermore, precision measurements require stability and fiducial accuracy at a level which is unprecedented in collider experiments. For the innermost vertex layers these goals translate into a target hit resolution of approximately 3 $$\mu \hbox {m}$$ μ m together with a material budget of around 0.2% of a radiation length per layer. Typically this performance might be provided by silicon-based tracking, together with a careful choice of a low-mass cooling technology, and a stable, low-mass mechanical structure capable of providing measurements with a low enough systematic error to match the tremendous statistics expected, particularly for the run around the Z resonance. At FCC-ee, the magnetic field will be limited to approximately 2 T, in order to contain the vertical emittance at the Z pole, and a tracking volume up to relative large radius is needed. The technological solution could be silicon- or gaseous-based tracking, in both cases with the focus on optimising the material budget, and particle identification capability would be an advantage. Depending on the global design, an additional silicon tracking layer could be added at the outer radius of the tracker to provide a final precise point contributing to the momentum or possibly time-of-flight measurement. Current developments in monolithic and hybrid silicon technology, as well as advanced gaseous tracking developments, provide an encouraging road map towards the FCC-ee detector. The current state of the art and potential extensions will be discussed and a generic call for technology which could have a significant impact on the performance of an FCC-ee tracking and vertexing detector is outlined.

show abstract

“…Challenges of this approach include the routing of the signals to the chip periphery and will depend on the technology chosen and the feature size of it. Some of these concepts have already been incorporated in ASICs such as the MALTA/Monopix chip [25] implemented in a modified Tower Jazz 180 nm process, and optimised for radiation hardness and speed [26], and were also included in the CLICTD sensor chip [27], optimised for extended efficiency for ultra thin silicon trackers.…”

Section: Monolithic Cmos Mapsmentioning

confidence: 99%

Tracking and Vertex detectors at FCC-ee

Barchetta¹,

Collins²,

Riedler³

2021

Preprint

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The combined vertexing and tracking performance of the innermost part of the FCC-ee experiments must deliver outstanding precision for measurement of the track momentum together with an impact parameter resolution exceeding by at least a factor five that typically achieved at LHC experiments. Furthermore, precision measurements require stability and fiducial accuracy at a level which is unprecedented in collider experiments. For the innermost vertex layers these goals translate into a target hit resolution of approximately 3 µm together with a material budget of around 0.2% of a radiation length per layer. Typically this performance might be provided by silicon-based tracking, together with a careful choice of a low-mass cooling technology, and a stable, low mass mechanical structure capable of providing measurements with a low enough systematic error to match the tremendous statistics expected, particularly for the run around the Z resonance. At FCC-ee, the magnetic field will be limited to approximately 2 T, in order to contain the vertical emittance at the Z pole, and a tracking volume up to relative large radius is needed. The technological solution could be silicon or gaseous based tracking, in both cases with the focus on optimising the material budget, and particle identification capability would be an advantage. Depending on the global design, an additional silicon tracking layer could be added at the outer radius of the tracker to provide a final precise point contributing to the momentum or possibly time of flight measurement. Current developments in monolithic and hybrid silicon technology, as well as advanced gaseous tracking developments provide an encouraging road map towards the FCC-ee detector. The current state of the art and potential extensions will be discussed and a generic call for technology which could have a significant impact on the performance of an FCC-ee tracking and vertexing detector is outlined. PACS. PACS-key discribing text of that key -PACS-key discribing text of that key 1 Introduction: tracking requirements for FCC-eeThe tracking volume which makes up the innermost part of any FCC-ee detector must be capable of delivering outstanding performance across the full acceptance, down to approximately 120 mrad, and full momentum range, typically with full efficiencies down to 300 MeV/c and 98% or better for muons down to 100 MeV/c transverse momentum. An overview of proposed detector layout and performance requirements can be found in the FCC-ee Conceptual Design Report (CDR) [1] and in this issue [2]. A driving factor in the design is that the magnetic field will be limited to approximately 2 T, in order to contain the vertical emittance at the Z pole, and a tracking volume up to relatively large radius will therefore be needed. It must be engineered in a way which results in minimum material in front of the external detectors and a stable structure which is capable of providing measurements with a low enough systematic error to match the tremendous statistics expected, particularly...

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CLICTD: A monolithic HR-CMOS sensor chip for the CLIC silicon tracker

Cited by 7 publications

References 2 publications

Design and Characterization of the CLICTD Pixelated Monolithic Sensor Chip

Design and Characterization of the CLICTD Pixelated Monolithic Sensor Chip

Tracking and vertex detectors at FCC-ee

Tracking and Vertex detectors at FCC-ee

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