Closure to “Discussion of ‘Oxidation of Copper to Cu[sub 2]O and CuO’ [D. W. Bridges, J. P. Baur, G. S. Baur, and W. M. Fassell, Jr. (pp. 475–478, Vol. 103)]”

Bridges, D.W.; Baur, John P.; Baur, G.; Fassell, W.M.

doi:10.1149/1.2428469

Cited by 29 publications

(46 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…According to the literature results for copper oxidation, [3][4][5][6][7] it is generally accepted that the growth of Cu 2 O is predominant at 873-1173 K. The rate-determining step in this temperature range is the outward diffusion of copper in Cu 2 O, as agrees well with Wagner's scaling theory. 8) Moreover, simultaneous lattice diffusion and grain boundary diffusion have been found to be responsible for the growth of Cu 2 O in this higher temperature range.…”

Section: Introductionsupporting

confidence: 69%

“…intermediate temperatures Some studies 5,17,18) showed that the thin CuO film for copper oxidation at and above 873 K is impervious to oxygen, and the oxygen potential at the Cu 2 O/CuO interface is determined by the dissociation pressure of CuO, which is constant at a given temperature. However, few works have been done to investigate the case at lower temperatures.…”

Section: Oxygen Pressure Dependence Of Activation Energy Atmentioning

confidence: 99%

See 1 more Smart Citation

Oxidation Mechanism of Copper at 623-1073 K

2002

View full text Add to dashboard Cite

In reviewing the results reported for copper oxidation at intermediate temperatures from 573 to 1173 K, the oxidation mechanism at the lower part of this temperature range and the reason for the change in activation energy with decreasing the temperature remain unclear. To make it clear, copper oxidation is studied at 623-1073 K under 0.1 MPa O 2 using a commercial 99.9999% pure copper. The oxidation kinetics is essentially parabolic, and the activation energy decreases from 111 kJ/mol at 873-1073 K to 40 kJ/mol at 623-773 K.

show abstract

Section: Introductionsupporting

confidence: 69%

Section: Oxygen Pressure Dependence Of Activation Energy Atmentioning

confidence: 99%

Oxidation Mechanism of Copper at 623-1073 K

2002

View full text Add to dashboard Cite

show abstract

“…According to a number of studies [4][5][6][7][8], the oxidation of copper follows the parabolic law of Pilling and Bedworth:…”

Section: Results Of Measurements Of the Kinetics Of Copper Oxidationmentioning

confidence: 99%

A manostat volumetric apparatus for studies on the kinetics of high-temperature reactions in solid-gas systems

Mrowec

Lason

Fryt

et al. 1974

Journal of Thermal Analysis

View full text Add to dashboard Cite

A new volumetric apparatus is described for continuous measurement of the kinetics of the oxidation of metals at high temperatures, and for measurement of adsorption and chemisorption of gases on solids. The measurement of the kinetics of oxygen fixation is performed automatically with very high precision. The oxidation of copper has been used to test the performance of the apparatus.Studies on the mechanisms of reactions in solid-gas systems, which include such processes as the thermal decomposition of solids and oxidation of metals and alloys, require the use of increasingly accurate methods of measurement [1,2].Kinetic measurements pray an essential role in these studies. In the case of oxidation processes, for instance, these measurements at various temperatures and pressures of the oxidizing medium provide valuable information about elementary processes which, under the given conditions, control the rate of the overall reaction. In many cases they allow calculations to be made of the defect concentration and self-diffusion coefficient of a metal or an oxidant in the solid product of oxidation of a metal or an alloy.Of the numerous methods used for studying the kinetics of the processes under discussion, two basic methods may be distinguished: a gravimetric and a volumetric method, which provide the most accurate results.In the present paper a new volumetric apparatus is described which makes it possible to obtain very accurate values of the rate constants of reactions in the given temperature and oxygen pressure ranges. Description of the apparatusDue to application of a new system of manostats, the apparatus to be described enables measurements of the volume of gas consumed by a sample under isothermal-isobaric conditions to be made with high precision. All operations involved in the measurement of the reaction kinetics, with the exception of the reading of a mercury level in the measurement burette, are automatic. The range of pressures of the apparatus used in the present work was 2-600 mm Hg. It will be possible in the future to extend this range by modifying the apparatus. The work on such a modification is now in progress.

show abstract

“…It has been concluded by numerous studies that while the rate of copper oxidation was increased with increasing temperature, oxygen pressure had no effect on the rate when the pressure is above the equilibrium potential for Cu/CuO. 1,2) Plascencia et al studied copper oxidation in the temperature range of 300-1 000°C. It showed that the oxidation was followed by logarithmic law of surface diffusion at 300-500°C, and by parabolic law of diffusion of copper ions through oxide layer at 600-1 000°C.…”

Section: Introductionmentioning

confidence: 99%

Oxidation Behavior of Pure Copper in Oxygen and/or Water Vapor at Intermediate Temperature

Wang

Cho

2009

ISIJ Int.

View full text Add to dashboard Cite

The oxidation of pure copper in oxygen with and without water vapor was investigated as a function of temperature, oxygen pressure, and water vapor pressure using thermogravimetric analysis. The rate of the oxidation was increased with increasing temperature from 500 to 700°C and followed by the parabolic rate law regardless of the presence of water vapor. The activation energy for the oxidation was 90.67 kJ/mol in dry oxygen and 95.86 kJ/mol in oxygen with water vapor. The change of oxygen pressure without water vapor does not affect the oxidation rate at given temperatures. However, increasing water vapor pressure from 0.39 to 0.58 atm resulted in higher oxidation rate due to the increase of copper vacancies. CuO whiskers were observed and their growth seems to be enhanced by the presence of water vapor.KEY WORDS: oxygen pressure; water vapor pressure; parabolic rate law; activation energy; CuO whisker.by scanning electron microscope (SEM) and X-ray diffraction (XRD). Experimental Experimental ProcedureA copper foil (99.99 % Cu) was purchased and was cut to make coupon specimens with a dimension of 1.5 cm in width and 2 cm in length. Before oxidation, the specimens were polished with SiC-paper in the order of size, 320, 500, 800, 1 200, 2 400, and 4 000, and then subsequently polished with diamond polishing suspension of grade 1 mm. After polishing, the specimens were cleaned in an ultrasonic cleaning bath with acetone.The oxidation of copper was carried out using thermogravimetric apparatus as shown in Fig. 1. The oxidizing gas mixture was passed through drierites to remove moisture before flowing into the reactor tube. Copper turning furnace was installed to reduce oxygen impurity in argon gas prior to passing through the reaction zone. The oxidizing gas mixture flows to the reaction zone from the bottom of the quartz tube, while purified argon gas flow is maintained through the electrobalance during the oxidation. A copper coupon specimen is suspended with a platinum wire in the reaction zone of the quartz tube and then heated up in ultrahigh pure argon. Once the desired temperature was reached, a mixture of reaction gases was introduced into the reaction tube until oxidation tests were finished. Oxygen partial pressure was controlled by mixing argon and oxygen. Continuous Oxidation with Water VaporThe oxidation of copper was also carried out in the presence of water vapor and the experimental apparatus consisted of thermogravimetric apparatus and heat-circulating bath which supplies water vapor continuously. A flask bottle containing water was placed in the bath and remained at constant temperature during the oxidation. Heating tapes were put on the top and bottom of the reactor tube as well as copper tubing between the reactor and the flask bottle. Some alumina balls were placed at the bottom of the reaction tube to mix the reaction gases. The gas mixture of oxygen and argon after passing through a mixing chamber were passed through water. A copper specimen placed in the reaction zone was heated in ultra-...

show abstract

Closure to “Discussion of ‘Oxidation of Copper to Cu[sub 2]O and CuO’ [D. W. Bridges, J. P. Baur, G. S. Baur, and W. M. Fassell, Jr. (pp. 475–478, Vol. 103)]”

Abstract: not Available.

Cited by 29 publications

References 0 publications

Oxidation Mechanism of Copper at 623-1073 K

Oxidation Mechanism of Copper at 623-1073 K

A manostat volumetric apparatus for studies on the kinetics of high-temperature reactions in solid-gas systems

Oxidation Behavior of Pure Copper in Oxygen and/or Water Vapor at Intermediate Temperature

Contact Info

Product

Resources

About