2009
DOI: 10.1061/(asce)hy.1943-7900.0000114
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Closure to “Field Measurements and Simulation of Bridge Scour Depth Variations during Floods” by J.-Y. Lu, J.-H. Hong, C.-C. Su, C.-Y. Wang, and J.-S. Lai

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Cited by 185 publications
(277 citation statements)
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“…Both types of lasers have recently been realized. [12][13][14][15] In particular, initial demonstrations of the latter have exploited hybrid plasmonic modes formed when a metal surface is separated from a dielectric by a low index gap region. 16 The resulting supermode allows the field intensity to be highly localized within the gap region, while keeping the losses moderately low.…”
mentioning
confidence: 99%
“…Both types of lasers have recently been realized. [12][13][14][15] In particular, initial demonstrations of the latter have exploited hybrid plasmonic modes formed when a metal surface is separated from a dielectric by a low index gap region. 16 The resulting supermode allows the field intensity to be highly localized within the gap region, while keeping the losses moderately low.…”
mentioning
confidence: 99%
“…To synthesize the Ag nanowires, 0.8 mmol silver nitrate, 1 mmol PVP and 2.2 µmol Fe(NO 3 ) 3 were dispersed in a flask heating in an oil bath at 160°C for 1 h. Figure 1 shows SEM and TEM images of the Ag nanowires. The nanowires have smooth surfaces with diameters around 100 nm and lengths up to 10 µm.…”
Section: Resultsmentioning
confidence: 99%
“…There are several methods have been reported, such as joule heating by electric, 1) electron or ion beam welding, 2) cold welding, 3) ultrasonic nanowelding, 4) femtosecond laser induced joining, 5) and soldering. 6) However, methods operated in microscopy greatly limit the industrial application and soldering inquires a strict structure of nanowires.…”
Section: Introductionmentioning
confidence: 99%
“…The interconnection of components with metallurgical bonds is a key requirement for micro/nano-electronic devices since conductive joints are needed in transistors, 13) sensors, 4,5) solar cells 6,7) and display units. 810) Commonly used lead-free soldering processes reach 200 to 300°C to obtain conductive joints, 11,12) which severely restricts joining for heat-sensitive components in flexible electronic devices.…”
Section: Introductionmentioning
confidence: 99%
“…810) Commonly used lead-free soldering processes reach 200 to 300°C to obtain conductive joints, 11,12) which severely restricts joining for heat-sensitive components in flexible electronic devices. 13,14) After a decade of efforts, low temperature interconnection processes using metallic nanoparticle paste through thermal sintering have been demonstrated with different metal nanoparticles, 1517) and appears to be a promising alternative for lead-free electronic packaging and flexible electronic interconnections.…”
Section: Introductionmentioning
confidence: 99%